NASHVILLE – April 2022 – Magnalytix, the forefront driver in providing real-time reliability solutions for electronics manufacturing, is thrilled to announce that Co-Inventor Dr. Mike Bixenman will present “Electrochemical Reliability of 2-D and 3-D Models as a Function of the Electrical Field Effects” on Tuesday, May 17, 2022, at the Park Plaza Victoria in Amsterdam from 3:30-4 p.m.

Selection of materials and process conditions is a critical step in building reliable electronics. As designs increase density and miniaturization, test methods are needed to measure the random effects of the process. Making invisible process residues visible enables the assembler to understand systems capabilities and to make system corrections. Understanding these random effects and controlling those factors improves quality.

Electrical field effects are a function of force per charge. As pad-to-pad spacing decreases, the force per charge increases. The objective of the research is measure insulation resistance in the 2-D and 3-D models as a function of volage and pad to pad spacing. The 2-D model uses open-comb test boards. An open comb has uniformity for conductor spacing, sheet resistance, and flux outgassing. Closer spacing increases the number of squares between the anode and cathode. A square is a function of the length divided by the gap between two conductors. As the number of squares increase, the sensitivity of the circuit to contamination goes up.

The 3-D model covers the open-comb test board with a glass slide. The 3-D simulates the effect of a leadless or bottom terminated component. Important factors include standoff gap, flux formulation, conductor spacing, and solder I/O mass. The 3-D model distorts the electric field due to flux residues not properly outgassed. This creates non-uniform sheet resistance.

Magnalytix looks forward to connecting with everyone at the show since it will be their first time attending. To register and attend Dr. Bixenman’s informative presentation as well as view additional conference information and program schedule, click here.

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