Solderability testing determines the solderability of electronic component terminations by providing the degree of wetting necessary to form robust solder interconnections.

Newman Lake, WA (May 3, 2022) – Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing solderability testing of components. This technical paper encompasses critically important information about the solderability testing process and is entitled “The Role of Solderability Testing and Its Importance in Successful Soldering.” This 5-page tech paper outlines essential information for circuit board assembly and can be downloaded by visiting www.rpsautomation.com/news/technical-papers.
Topics covered within this publication include solderability test methods, testing protocols, acceptance criterion, and testing procedures.  The dip-and-look qualitative test method and the wetting balance quantitative test method are described in detail as well as the reasons behind the need to perform solderability testing to ensure frobust and reliable solder joints.

About Hentec Industries

Hentec Industries/RPS Automation is a manufacturer of automated selective soldering, component lead tinning, and solderability test equipment for electronics and electronic component manufacturing, assembly, and distribution.  Hentec/RPS has been advancing automated soldering and lead finishing technology for defense, aerospace, automotive, contract manufacturers and micro-electronics component manufacturers since the early 90’s. All Hentec/RPS products are designed and manufactured in Newman Lake, Washington.  For more information, please visit us at www.rpsautomation.com.

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