Odyssey 1750 provides high reliability BGA alloy exchange and component re-finishing capabilities.

Newman Lake, WA (June 28, 2022) – Hentec Industries/RPS Automation is pleased to announce that Topline Electronics has finalized the purchase of a Hentec/RPS Odyssey 1750 robotic hot solder dip component lead tinning machine.  The Odyssey 1750 is a MIL spec complaint high-volume, high-mix component lead tinning machine equipped with auto load/unload functionality and is capable of processing dual solder alloys.  Designed to tin component leads for re-conditioning, gold removal and re-tinning applications, including high reliability and military applications including DIP, SIP, QFP, BGA, axial and radial components as well as BGA de-balling.  The Odyssey 1325 complies with all applicable GEIA-STD-006, MIL-PRF-38535, MIL-PRF-38524E and ANSI-J-STD-002 standards.

About Topline Electronics

Headquartered in Patterson, New Jersey, Topline Electronics is a major supplier of dummy electronic components for the worldwide electronics assembly industry.  Their products and services are distributed on a global basis to multiple countries around the world.  For more information, please visit: www.topline.com.

About Hentec Industries

Hentec Industries/RPS Automation is a manufacturer of automated selective soldering, component lead tinning, and solderability test equipment for electronics and electronic component manufacturing, assembly, and distribution.  Hentec/RPS has been advancing automated soldering and lead finishing technology for defense, aerospace, automotive, contract manufacturers and micro-electronics component manufacturers since the early 90’s. All Hentec/RPS products are designed and manufactured in Newman Lake, Washington.  For more information, please visit us at www.rpsautomation.com.

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