HAVERHILL, MA — The motivation behind component lead tinning is to facilitate the removal of gold plating to eliminate the risk of gold embrittlement, tin whisker mitigation, or processing components for applications that require refinishing with lead-free solder for RoHS compliance. The ideal method to facilitate the removal of gold plating and mitigate tin whiskers from SMT and through-hole components is to use the robotic hot solder dip (RHSD) process. This new white paper from Circuit Technology Center examines the key process considerations when undertaking this process.

The full white paper can be viewed here: https://www.circuitrework.com/features/1067.html

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