The Occam Process reverses traditional component assembly removing its greatest vulnerability

EL DORADO HILLS, CALIFORNIA --A Game-changing component assembly methodology will transform product confidence in the harshest environments.

Most electronic manufacturing defects are related to the soldering process and most field failures occur as a result of solder weaknesses such as fatigue due to shock and vibration and/or repeated thermal excursions in operations or rework.

The Occam Process is a game-changing solderless assembly technology that reorders the way electronic components are assembled, greatly improving reliability and performance, while significantly reducing product size and cost. With Occam, solder related failures are eliminated because solder itself is eliminated. The Occam approach bypasses the weakest link, inherently driving up product reliability while opening the door to a host of new capabilities and benefits for product designers.

Occam inventor Joe Fjelstad commented: “Occam isn’t just a new process but a reordering of current methods. It is an enabling technology allowing the industry to move toward a future where higher reliability, lower costs and less environmental impact are the norm. Occam will transform the industry into something substantially simpler and better.”

To learn more about The Occam Process download the ebook, SAFE, Solderless Assembly for Electronics

For more information on how to join the Occam revolution, visit the Occam website: theoccamgroup.com or contact managing partner, Ray Rasmussen at: ray@theoccamgroup.com, 916-337-4402

About The Occam Group

This group’s sole purpose is to find committed partners desiring to adopt and integrate the Occam Process into their businesses. The Occam team is composed of three seasoned electronics industry veterans from the US and Germany: Joe Fjelstad, Ray Rasmussen and Silvio Bertling. Collectively they have over a century of relevant experience.

Joe Fjelstad is the inventor of the Occam Process and has been active in electronics manufacturing since 1972 in various roles, including chemist, process engineer, and R&D manager. He holds nearly 190 U.S. Patents and numerous foreign ones. One of his patents for a low profile bottom leaded IC package presaged the QFN and is today cited in more than 550 other patents. He is an internationally recognized book and column author, electronics interconnection technology expert, inventor and lecturer in the field of interconnection technology and is as well a veteran of several startup companies beyond Verdant Electronics, including: Beta Phase, ELF Technologies, MetaRAM, Silicon Pipe, , Tessera (now the public company, Xperi where he was the first appointed company fellow.

Ray Rasmussen is a widely respected veteran PCB industry watcher, reporter and analyst and trusted source and sounding board for numerous industry executives. He was co-founder, editor and publisher of CircuiTree magazine, publisher of SMT Magazine and iConnect007.

Silvio Berling is a seasoned, innovative and accomplished electronics engineer with over 30 years of experience in the field specializing in printed circuit board materials, leading teams for major materials suppliers in the U.S. and Europe. T

he Occam Process, is aptly named in honor of 14th Century English Philosopher William of Occam, who taught his followers, “It is vanity to do with more, that which could be done with less,” an idea which was inspirational to the process as conceived.

Contact us at: The Occam Group

Media contact: ray@theoccamgroup.com

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