HANAU, GERMANY — Heraeus Electronics will exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The company will showcase three innovative products designed to meet current and future SMT challenges. New solutions are needed to meet the increasing demands for miniaturization, reliability and TCO challenges.

Heraeus has answered the industry’s need, and will introduce the next evolution of Solder Paste to address these challenges in Booth #2419 during the IPC APEX EXPO.

The all-new paste system is a high reliability, high performance paste system with a competitive TCO offering. Based on proven experience of Heraeus Electronics, the new paste system allows a wide process window, enabling soldering in air with low defects. Additionally, it is designed to offer an optimized formulation for lower material costs. Moreover, the company will discuss its proven Innolot Solder Paste and mAgic® DA320 Sinter Paste.

Heraeus’ SMT 650 Innolot solder paste achieves a consistently high surface insulation resistance that prevents electrochemical migration. The combination of the flux system with Innolot alloy delivers superior reliability— especially in miniaturized systems in the automotive industry. In addition, the developed flux system can also be combined with SAC305.

mAgic® DA320 is a high shear strength, non-pressure dispensing sinter paste for die attach of power applications. With high thermal conductivity, it offers fast sintering at low application temperatures from 200°C and above to form quality interconnections.

For more information about the company’s innovative materials portfolio, visit Heraeus experts in Booth #2419 during the IPC APEX EXPO.

To learn more about Heraeus Electronics, visit www.heraeus-electronics.com

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