PENANG, MALAYSIA — X-ray Inspection (AXI) equipment has become increasingly prominent in the circuit board industry with the emergence of intelligent terminal equipment and intelligent automotive electronic products. Electronic components are developing towards miniaturisation, refinement, and complexity. Therefore, manufacturers use AXI equipment for their production inspections to ensure reliable detection ability to pursue high product yields with high-quality final products.

To address these needs, ViTrox’s V810i Advanced 3D X-Ray Inspection (AXI) solution provides full board test coverage with the latest vision technologies and advanced inspection capabilities for accomplishing the testing of hidden joints on printed circuit boards within the required inline cycle time. With the V810i AXI solution, manufacturers can optimise production throughput and enjoy speedy and precise inspection capabilities.

Our smart V810i AXI solution offers world-class board inspection capabilities and Industry 4.0- compliant software for quality-assured inspection results. The V810i AXI solution provides full board test coverage with the latest vision technologies and advanced inspection capabilities for accomplishing the testing of hidden joints on printed circuit boards within the required inline cycle time. Besides, it is capable of handling the largest and heaviest PCB (size up to 52"x52" and weighing up to 25kg) in the market.

The latest V810i Series 3 (S3) AXI comes with a new ergonomic outlook that saves space capacity for users. By embedding its RRS Server (3DCT) and Supermicro (System Server) in the machine while eliminating the location of the external servers at the system’s exterior, the new design allows users to easily incorporate the solution into production lines while saving up more floor space. Additionally, equipped with an in-house developed Algebraic Reconstruction Technique (ART) with a model of sharp geometric 3D computed tomography, the V810i S3 AXI simplifies the process of performing accurate defect failure analysis results for further improvement.

The V810i AXI solution is equipped with a powerful test algorithm that provides automated and full-board 100% test coverage for PCB assemblies, hidden joint-related components, and more:
• Integrated power electronic components (i.e. IGBT) for high-power applications,
• Discrete components (i.e. transistor, resistor, capacitor),
• Connectors (i.e. SMT connector, variable height BGA connector, etc),
• RNet, SMT Connector, Gullwing,
• BGA (collapsible, non-collapsible, etc)
• PTH, Single Pad,
• Backdrill, and many more.

Furthermore, the V810i AXI solution integrates artificial intelligence (A.I.) capabilities to expand the opportunity for AXI inspection, enabling our unique A.I. inspection model to detect defects/abnormalities of specific joint types and further improve the inspection accuracy for both challenging and common pads, including pads consisting of multiple grayscales or unique profiles and characteristics.

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