NEWMAN LAKE, WA — Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability testing equipment, is pleased to announce it will exhibit its Vector 600 selective soldering and Odyssey 1325 lead tinning systems at the upcoming IPC EXPO 2023. This popular international event will be held at the San Diego Convention Center, in San Diego, California on January 24-26, 2023, with the Vector 600 and Odyssey 1325 systems to be displayed in Booth 2916.

The Vector 600 is a lead-free compatible system that features an integrated computer with unlimited program storage, integrated system software, witness camera and auto fiducial correction. Available in either standalone or SMEMA in-line configurations, the Vector 600 is offered with topside preheat, spray or drop-jet fluxer, dual flux nozzles, and custom or wave solder nozzles. As with all other Hentec/RPS systems, the Vector 600 is UL and CE compliant and carries both a two-year system warranty and a four-year solder pot warranty.

The Odyssey 1325 is a MIL spec complaint high-volume, high-mix component lead tinning machine and is capable of processing dual solder alloys. Designed to tin component leads for re-conditioning, gold removal and re-tinning applications, including high reliability and military applications including DIP, SIP, QFP, BGA, axial and radial components as well as BGA de-balling. The Odyssey 1325 complies with all applicable GEIA-STD-006, MIL-PRF-38535, MIL-PRF- 38524E and ANSI-J-STD-002 standards.

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