CLINTON, NY — Indium Corporation® will feature selections from its portfolio of proven products for power electronics applications at the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM), February 1‒3 in Miami, Florida. In addition, Indium Corporation’s Principal Engineer and Manager for the Thermal Interface Materials Applications, Dr. Andy Mackie, will chair a technical session on interconnects and lead attachments on February 2.

Amongst the company’s award-winning portfolio of proven products for power electronics, Indium Corporation will feature:

• InFORMS® are reinforced solder alloy fabrications that improve mechanical and thermal reliability and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
• InTACK™ is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK™ is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, creating a low-cost tooling-free solution without compromising soldering quality.
• QuickSinter® is a high metal content paste, redefining sinter technology for power electronics. Available in pressureless and pressure formulations, this portfolio of sintering solutions delivers products engineered for customers’ specific application needs.
• Durafuse™ HT features a novel design based on a novel alloy technology, designed to deliver a tin-rich, high-temperature lead-free (HTLF) paste, presenting the merits of both constituent alloys. Durafuse™ HT delivers simplified processing, with no special equipment needed, and enhanced thermal cycling reliability equal to or higher than a high-Pb solder.

Dr. Mackie is an electronics industry expert with a technical background in physical chemistry, surface chemistry, rheology, and semiconductor fabrication and assembly materials and processes. His professional experience covers all aspects of electronics manufacturing from wafer fabrication to semiconductor packaging and SMT/electronics assembly. In his current role, he is focused on identifying thermal material needs and trends for various high-performance applications, as well as the development and testing of innovative solutions to meet the emerging thermal interface material requirements. Dr. Mackie has been an invited international keynote speaker and has lectured internationally on subjects ranging from sub-ppb metals analysis in supercritical carbon dioxide to solder paste rheology. He holds patents in novel polymers, heterogeneous catalysis, and solder paste formulation. Dr. Mackie holds a Ph.D. in physical chemistry from the University of Nottingham, UK, and a Master’s of Science (MSc) in colloid and interface science from the University of Bristol, UK.

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