Whitepaper Discusses Critical Process Steps for High-Reliability BGA Device Re-balling
Published: 12 July 2023
by Tyler Hanes
HAVERHILL, MA – The re-balling of BGA components from lead-free to tin-lead solder is a critical requirement by some high-reliability customer applications due to tin-whisker mitigation concerns. This technical paper by Circuit Technology Center discusses the key process steps of this highly specialized process.
See the full paper at: https://www.circuitrework.com/features/1040.html
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