August 1, 2023 – Launched at the beginning of the year, ECD’s M.O.L.E.™ EV6 thermal profiler has far exceeded initial sales projections, the company announced today. A complete paradigm shift from conventional thermal profiling, M.O.L.E. EV6 delivers handheld access to profiles, calculation templates, pass/fail analysis, and more – on the production floor. No PC download is required to effectively view, analyze, and optimize a thermal profile. According to many ECD partners and early adopters, this technology is long overdue.

Debuted in January with shipments beginning April 2023, the M.O.L.E. EV6 saw record order demand compared to ECD’s previous thermal profiler launch. M.O.L.E. EV6 sales were more than double those of its predecessor during a similar six-month period. According to ECD Electronics Division Manager, Mark Waterman, this validates the team’s innovative vision of what electronics assembly operators and process engineers need to perform their job most effectively.

“Now more than ever, production efficiency is vital to remain competitive in the electronics manufacturing market,” says Waterman. “Touchscreen control and on-the-fly data access for immediate corrective actions enables operators to simplify and streamline the profiling process. Productivity is raised, errors reduced, and decision-making is informed and immediate.”

While ECD is delighted with the early success of M.O.L.E. EV6’s adoption, Waterman notes that there is plenty more to come: “We anticipate this order trajectory to continue – and even accelerate – as this is truly the most significant thermal profiling product innovation in the last decade,” he says. “The new M.O.L.E. technology platform, along with user input, will influence the development of several other ECD profiling tools we anticipate bringing to market soon. Stay tuned!”

To learn more about M.O.L.E. EV6, its scalable capability with RIDER™ machine quality management tools, or any of ECD’s process control technologies, visit www.ecd.com.

Except as otherwise noted, all marks used herewith are trademarks and/or registered trademarks of ECD and/or its affiliates in the US and elsewhere.

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