NEWMAN LAKE, WA – Hentec Industries/RPS Automation is pleased to announce that TE Connectivity has ordered a Hentec/RPS Odyssey 1750 robotic hot solder dip component lead tinning system for installation in their Mount Joy, Pennsylvania facility.

The Odyssey 1750 is a MIL spec complaint high-volume, high-mix component lead tinning machine equipped with auto load/unload functionality and is capable of processing dual solder alloys. Designed to tin component leads for re-conditioning, gold removal and re-tinning applications, including high reliability and military applications including DIP, SIP, QFP, BGA, axial and radial components as well as BGA de-balling. The Odyssey 1750 complies with all applicable GEIA-STD-006, MIL-PRF-38535, MIL- PRF-38524E and ANSI-J-STD-002 standards.

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