iNEMI Packaging Tech Topic Series Webinar
LSI/PKG/PCB Co-Design to Support 3D-IC/Chiplet Design
Guest Speaker: Kazunari Koga, Zuken Inc.
November 28, 2023

Chips and packages have different manufacturing methods and data sizes, so the design tools are also different. This webinar will introduce new software technology that can handle — in one tool —two types of design data. This technology connects design data for different technologies in a hierarchical structure and allows all data to be edited simultaneously. It also addresses the issues of designing a package that implements chiplets. This includes the challenges of large-scale design data (due to increasing nets between chips), device implementation of heterogeneous technologies with a mixture of substrate and silicon, and I/O design complexity.

About the Speaker
Kazunari Koga
Zuken Inc.

Mr. Koga has been working with development of an LSI/package/board (LPB) co-design environment since 2007. He joined the JEITA LPB working group in 2010, and participated in the development of LPB formats, which became an IEEE standard in 2015. He was also involved in the Semiconductor Technology Academic Research Center’s (STARC’s) development of a design methodology for 3D ICs, and the New Energy and Industrial Technology Development Organization’s (NEDO’s) development project for a 3D integrated design and verification platform.

Registration

This event is open to industry; advance registration is required (see link below). If you have any questions or need additional information, please contact Masahiro Tsuriya (m.tsuriya@inemi.org).

November 28, 2023
8:00-9:00 a.m. EST (US)
2:00-3:00 p.m. CET (Europe)
10:00-11:00 p.m. JST (Japan)
Register for this webinar

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