Irvine, California, USA - TopLine Corporation will share a booth (Booth #565) with Tanaka Precious Metals at the upcoming APEC 2024 (Applied Power Electronics Conference) at the Long Beach Convention & Entertainment Center, Long Beach, California, February 25-29, 2024.

TopLine, a well-known provider of CCGA semiconductor packages for engineering development, will be exhibiting only Tanaka bonding wire and products at this show.

TANAKA specializes in quick delivery of bonding wire for IC modules and battery interconnects, including round wire and flat ribbon from USA domestic stock for next day delivery; this includes Gold, Aluminum, Silver, Copper and Platinum for Military/Aerospace, Other Semiconductors and Discrete Semiconductors, ICs, Sensors and Input Devices.

The Applied Power Electronics Conference (APEC) focuses on the practical and applied aspects of the power electronics business. Not just a designer’s conference, APEC has something of interest for anyone involved in power electronics. For more information, visit https://apec-conf.org; for more information about TopLine’s TANAKA offering, visit http://www.Topline.tv/tanaka.html.

About TopLine

TopLine manufactures a wide range of solder columns for CCGA semiconductor packages, and provides Daisy Chain CCGA packages for engineering development, profiling and practice. TopLine products provide hands-on learning for engineers. To learn more, visit www.CCGA.tv or call (1+) 800 – 776-9888.

About TANAKA

TANAKA Precious Metals is a premier manufacturer of bonding wire to the semiconductor industry. TANAKA offers a full range of Gold (Au), Silver(Ag), Aluminum (Al), bare Copper (Cu) and Palladium Coated Copper (PCC) covering all applications of wedge, ball and bump bonding.

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