PDR to Present Advanced Rework & High-Performance Compact X-ray Systems at the IPC APEX EXPO
SHINGLE SPRINGS, CA – PDR Americas is set to showcase its latest innovations at the 2024 IPC APEX EXPO. The event is scheduled to take place from April 9-11, 2024, at the Anaheim Convention Center in California. Visit PDR at Booth 3829 to experience firsthand the IR-E3 System for rework and the GenX90 w/ Vector Nav 3D CT Tomography for X-ray.
The PDR IR-E3 is an advanced rework station designed to cater to BGA/SMT components with precision and efficiency. This cutting-edge system boasts key features such as advanced focused IR component heating, quartz IR PCB preheating with up to 3 zones, and a Split Beam prism system enabling simultaneous PCB/component viewing.
The station ensures precision in component placement up to 10um, precise PCB handling, and includes a Component Nest/Flux Application Facility. With closed- loop non-contact temperature sensing, advanced automatic thermal process control, a reflow process observation camera, and PCB forced air cooling, the IR-E3 streamlines the rework process, setting a new standard for accuracy and control across a diverse range of components.
Additionally, PDR will showcase the GenX-90P, an ultra-high- performance X-ray system designed for precision inspection.
Key features include:
- Compact system, accommodating PCB sizes up to 21” (533mm) X 17.5” (445mm)
- Customizable Flat Panel Detectors or Image Intensifier options
- 90kV, 8 Watt, 4um X-Ray tube, 0.18mA with Magnification up to 1100X
Primarily designed for BGA inspection and analysis, counterfeit inspection, porosity/voiding detection, medical device inspection, wire bond inspection, and LED inspection, this system ensures precise and reliable results. With radiation levels less than 1 uSv/hr (0.1 mR/hr) and compliance with USFDA 21 CFR-1, J-1000, 1020.40 standards, it prioritizes safety in all operations. The GenX-90P is equipped with programmable 4-axis (X, Y, Z1/Z2) fully motorized motion control, facilitating comprehensive inspection capabilities. Its BGA/QFN/Flip Chip software includes Pass/Fail criteria, Sphere Size, Void analysis, and a 3D Gray Scale Option.
Visit PDR at Booth 3829 during the IPC APEX EXPO to explore these groundbreaking solutions and learn more about how PDR is shaping the future of electronic rework and inspection.
For more information about PDR Rework and its innovative solutions, please visit www.pdr-rework.com
