Circuits Assembly Online Magazine - Indium Corporation, Industry Partners to Showcase Products “Live@APEX”

CLINTON, NY – Indium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 9‒11 in Anaheim, Calif., U.S.

Live@APEX is a unique collaboration between Indium Corporation and its industry partners. The program benefits all participants, including Indium Corporation, partners, and, most importantly, the customers, who get to experience the equipment and materials in a live-action environment.

“By demonstrating Indium Corporation products on live equipment at IPC APEX, attendees get an accurate and honest depiction of the material’s performance,” said Product Development Specialist Miloš Lazić. “The program is a great embodiment of Indium Corporation’s motto, ‘From One Engineer to Another®’, and we are tremendously proud of it.”

This year’s program will highlight Indium Corporation materials, including:

CW-807 – electronics soldering cored wire
CW-818 – no-clean, high-reliability flux-cored wire
FP-500 – no-clean flux pen
Indium8.9HF – no-clean solder paste formulated for the higher processing temperatures of the electronics industry
Indium9.88HF – no-clean solder paste for use in package-on-package (PoP) applications
Indium12.8HF – jetting and microdispensing solder paste
PicoShot® – jetting paste series with exceptional jetting performance
Sn995 – low-maintenance, low-cost, Pb-free soldering alloy
TACFlux® 089HF – no-clean flux formulated for SnAgCu and SnAg solders (also compatible with Sn/Pb solder)

You can see these products at the following partner booths: