CLINTON, NY – Indium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.

At 10 a.m. local time, Indium Corporation Junior Application Engineer Siegfried Lorenz will present on a new solder paste technology for high-reliability applications. Based on novel solder paste alloy technology, this material offers special wetting behavior that supports low-voiding and enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C). It also reduces solder joint cracking and increases shear strength.

“Perfectly suited for high-reliability applications, this new solder paste technology is the ideal choice for demanding applications that require longer thermal cycles,” said Lorenz. “The EPP InnovationsFORUM is an ideal platform to share this exciting data with my colleagues.”

Lorenz is responsible for providing application engineering support for Indium Corporation’s customers throughout Germany, Austria, and Switzerland. He provides customers with engineering and specifications assistance. He also helps to accelerate the sales cycle by providing technical recommendations. Prior to joining Indium Corporation, Lorenz held positions as a senior mechanic, SMD operator, and head of SMD with major semiconductor manufacturers and electronic design firms. He holds a bachelor’s degree in electrical technology and management.

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