NEWMAN LAKE, WA – Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality. This technical paper encompasses critically important information and is entitled “An Essential Guide to Optimize Selective Soldering Processing.” This 8-page tech paper outlines essential information for circuit board assembly processes and can be downloaded by visiting www.rpsautomation.com/news/technical-papers 

Topics covered within this publication include flux selection, flux application, thermal processing, no-clean thermal processing, flux residue mitigation, solder nozzle design, system flexibility, gold embrittlement, gold removal, and solderability testing.

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