MANASSAS, VA – ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges. Designed to address the evolving challenges in semiconductor manufacturing, this comprehensive series of webinars will delve into cutting-edge topics crucial for optimizing processes and enhancing reliability.

Led by Senior Application Engineer Ravi Parthasarathy, ZESTRON's upcoming webinar series promises to be an indispensable resource for professionals in the semiconductor industry. With a focus on addressing the unique challenges and requirements of semiconductor manufacturing, each session will deliver invaluable insights and practical solutions. Recognizing the intricate demands of the semiconductor sector, the webinars will provide tailored content designed to meet the specific needs of industry professionals, from semiconductor fabrication facilities to electronic component manufacturers. Ravi brings a wealth of expertise and experience to the table, with years of hands-on involvement in advanced packing and power electronics cleaning technologies, offering a unique perspective on the industry's evolving landscape and ensuring that participants receive expert guidance backed by real-world insights.

The webinar series will foster an interactive learning environment, encouraging participants to engage with the material and exchange ideas with fellow industry professionals through live Q&A sessions. In an industry where innovation is constant, staying ahead of the latest developments is paramount. ZESTRON's Advanced Packaging & Power Electronics webinar series serves as a platform for continual learning, empowering semiconductor professionals to remain at the forefront of their field.

Webinar Topics Include:

• Optimizing High Bandwidth Memory (HBM) Wafer Surface Treatment: Navigating Cleaning Challenges
• Tackling Flux Residues: Best Practices for Cleaning Power Electronics Components
• Unveiling Defluxing Strategies for High-Density Advanced Packaging with Ultra-Fine Pitch Die on CoWs
• Advancing Reliability in Automotive Power Electronics: Cleaning Strategies and Corrosion Mitigation

For registration and more information, visit ZESTRON’s website: ZESTRON Semicon Webinar Series

• Prev
• Next