CLINTON, NY – As one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, June 11-13, in Nuremberg, Germany.

Tuesday, June 11

• Moving to Pb-Free for Power Discrete Die-Attach by Product Manager – Semiconductor Dean Payne
  • Pb-based solder has been the standard material for power discrete die-attach for decades. This session will focus on the various Pb-free alternatives, their pros and cons, and the challenges faced when switching from Pb-based solder to Pb-free solder.

Wednesday, June 12

• Solder Material Optimization that Enables Reliable Power Module Heat Dissipation by Regional Technical Manager and Technologist – Advanced Applications Andreas Karch
  • As power densities continue to increase for power module devices, there is a corresponding need for improved thermal management. This presentation will explore thermal interface and soldering material technologies that can be leveraged for improved thermal performance and extended lifecycle reliability in these applications.
  • The presentation will be given in German.
• Power Electronics Materials and Process Optimization by Product Manager – ESM/Power Electronics Joe Hertline
  • This presentation will explore the design criteria for materials selection in SiC molded package-attached applications, balancing cost, performance, and manufacturability. An emerging solder alloy technology will be highlighted, which can mitigate package warpage and delamination in the package and enable soldering as a thermal interface material in these applications.
  • Solder Preform Technology for Improved Thermomechanical Performance in Molded Power Module Package-Attach poster session by Hertline This SAC-In alloy technology reduces peak temperatures, removing the risk of delamination with molded package power modules. This Bi-free alloy provides favorable mechanical properties to achieve reliability performance comparable to SnSb5 for thermal shock testing -40°C/125°C.

All presentations will be given in English unless otherwise noted.

Andreas has more than 20 years of experience in automotive electronics and power electronics, including the development of advanced customized solutions. In 2014, the Austrian Patent Office awarded him the “Inventum” award for his innovative LED automotive lighting patent as one of the top ten applicants. He is an ECQA-certified development engineer and has earned the Six Sigma Yellow Belt.

Joe is responsible for driving the power electronics product line’s growth by developing and implementing marketing strategies supported by customer experience, emerging technologies, and industry feedback. Hertline also collaborates with Indium Corporation's sales, technical support, R&D, production, and quality teams to serve existing customers and grow new business in his designated market. He earned a bachelor’s degree in mechanical engineering and an MBA from Clarkson University and is a Certified SMT Process Engineer (CSMTPE).

Dean is responsible for driving profitable growth of Indium Corporation’s power semiconductor materials, which include high-Pb die-attach paste, high-temperature Pb-free solutions, and sintering materials. He has more than 13 years of experience in semiconductor/wafer fabrication. Dean holds multiple certifications from the University of Wales and Coleg Gwent in the United Kingdom, including the Level 3 National Vocational Qualification in electrical and electronic engineering, the Higher National Certificate in electrical and electronic engineering, and the Higher National Diploma in engineering.

To learn more about Indium Corporation’s solutions for power electronics, be sure to visit our experts at PCIM in hall 6, stand #466.

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