WALTHAM, MA – Essemtec is exhibiting at SMTconnect booth 4.209.

We invite you to SMTconnect, Booth 4.209, from June 11 - 13 in Nuremberg, Germany. Discover Essemtec's solutions with all-in-one combined dispensing & pick-and-place processes and integrated inspection systems.

We are presenting the latest product advancements and SMTconnect premieres:

• Tarantula Underfill
• Fully Integrated PCB Inspection
• BGA Dispensing and Reballing

Tarantula Underfill is our latest addition to our machine lineup. Our new solution will meet your underfill process needs while also performing all other traditional dispensing operations in the same machine, thanks to the 5 different valve options from Essemtec. These valves cater to a wide range of dispensing applications such as Solder Paste, SMT Glue, LED Encapsulation, Silver Epoxy, and Dam, among others.

Furthermore, we will showcase our flagship equipment Puma All-in-One with multiple functionalities:

• High-Speed Solder Paste Jetting Solution with our Jet-on-the-fly
• Integrated Inspection System for PCB inspection
• EVO feeder 4mm, 08004 Pick-and-Place

The All-in-One platform with dispensing and pick-and-place functionalities will demonstrate live the highest standards in electronics assembly on flexible substrates, jetting multiple fluids three times faster, and efficient rework on populated boards.

On our production line, we will demonstrate the reballing and flux dispensing with pick-and- place in one go, as well as our line change preparation using our Smart Manufacturing Solution.

Under the motto “Our Focus - Your Solution,” we also focus on proven solutions in various segments for electronics production, such as NPI, High-mix / Low-Volume, High-speed Dispensing, Printed Electronics, and Complex repair.

More information on our latest solutions:

Integrated Inspection System – for all product platforms

For the first time in the industry, an Integrated Inspection System (I2S) in the Pick-and-Place and dispensing solutions will be shown. The Integrated Inspection System is available for dispensed and jetted material as well as placed SMD components right after the process.

Thus, only good, inspected products are entering the reflow ovens. The process also includes an automated repair function. The system is already integrated in production sites by various companies.

Smart Material Management - integrated solution for factory 4.0

The affordable material management solution is a fully integrated end-to-end solution for electronics manufacturing factories and covers all different storage locations. The solution enables right material placement at the right time. The traceability is precise down to individual components. The solution is expandable and flexibly controlled by an intuitive eStorage software, from simple barcode-labelled storage locations to fully automated storage cabinets. The solution offers high ROI and is fully integrated with the production machine and the ERP systems.

Our team of engineers will share the best tips on SMT topics to help you increase the flexibility of your production line and optimize your manufacturing costs. Visit us in Hall 4 at booth 209 and be inspired by our solutions!

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