High-Speed Line Inspection at the SMTA Guadalajara 2024
GUADALAJARA, MEXICO – Test Research, Inc. (TRI) will join the SMTA Guadalajara Expo 2024 to showcase our award-winning Inspection solutions for the SMT industry. Visit booth #1018 at the SMTA Expo Guadalajara from September 11 to 12, 2024, to experience the latest test and inspection innovations for the Electronics Manufacturing Industry.
TRI will showcase the High-Speed Line 3D AOI, TR7700QH SII, able to inspect at speeds of up to 80 cm²/sec, featuring a 21 MP camera with 15 μm resolution, achieving a 40% speed improvement over its predecessor. For instance, it inspects a dense 336 x 208 mm board in 9 seconds and a 577 x 360 mm telecom server board in 66 seconds.
The TR7700QH SII's high inspection speed increases throughput and reduces inspection time, lowering overall costs. This is especially beneficial in high-volume production, where small cost reductions lead to significant savings. Its ease of programming and AI solutions reduce operational costs and downtime by minimizing training efforts and required expertise.
In addition to the TR7700QH SII, TRI will also present our award-winning 3D Solder Paste Inspection (SPI) solution, the TR7007QI Plus. TRI will also showcase the High-Pin-Count In-Circuit Test (ICT) solution, TR8100LLV, and a live demonstration of our cutting-edge Automated 3D X-Ray Inspection (AXI) system.
Discover why leading Electronics Manufacturing Services (EMS) companies rely on TRI as their test and inspection partner. Visit us at SMTA Guadalajara 2024, booth #1018, for a personal demonstration of TRI's industry-leading One Stop Solution for PCB Assembly Testing and Inspection.
