CLINTON, NY – As a proven leader in innovative materials solutions for future-forward technologies, Indium Corporation will proudly showcase its heterogeneous integration and assembly (HIA) products and thermal interface materials (TIMs), that are driving AI advancements, at SEMICON Taiwan, September 4-6, in Taipei, Taiwan.

Indium Corporation’s SiPaste® series is specifically designed for fine-feature printing, with fine powders ranging from Type 5 to Type 8. They help Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance. Indium Corporation’s SiPaste® C312HF is a new formulation offering the same excellent printing performance and material stability over time, with the benefit of having an easily cleanable chemistry with semi-aqueous or saponifier technology.

Indium Corporation’s Heat-Spring® solutions, ideal for TIM2 applications, is a compressible, non-reflow metal TIM. These indium-containing TIMs offer superior thermal conductivity over non-metals—with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring® avoids pump-out and bake-out problems. It also offers a sustainable solution due to Indium Corporation’s reclaim and recycle program.

The GalliTHERM® portfolio of gallium-based liquid metal solutions draws on Indium Corporation’s more than 60 years of experience manufacturing gallium-based liquid metals. These liquid metal TIMs are designed for both TIM1 and TIM2 applications. Liquid metal TIMs offer:

• High thermal conductivity for end-product longevity and reliability
• Low interfacial resistance against most surfaces, ensuring rapid heat dissipation
• Extraordinary wetting ability on both metallic and non-metallic surfaces

To learn more about how Indium Corporation’s HIA and TIM products are helping to drive the AI revolution, visit our experts at booth #L0330 at SEMICON Taiwan.

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