CLINTON, NY – As one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its innovative Durafuse® solder technology at Productronica India, September 11-13, in Delhi, India.

Indium Corporation will showcase the following among its featured products:

• Durafuse® LT is an award-winning solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and low-temperature step soldering. It's ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse® LT delivers superior drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and even outperforms SAC305 with optimal process setup.
• Durafuse® HR, based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
• Durafuse® HT is an innovative Pb-free solution designed to deliver a high-temperature lead-free (HTLF) paste for discrete power electronics devices.
• Durafuse® HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than a high-Pb solder.

Some of the additional products featured will include:

• Indium8.9HF Solder Paste Series, an industry-proven solder paste series, delivers no-clean, halogen-free solutions designed to achieve high surface insulation resistance (SIR) and improve stability during the printing process for high-reliability automotive electronics.
• Indalloy®301 LT Alloy for Preforms/InFORMS® is a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys.
• SiPaste® series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance.
• Heat-Spring® solutions, ideal for TIM2 applications, is a compressible, non-reflow metal TIM. These indium-containing TIMs offer superior thermal conductivity over non-metals—with pure indium metal delivering 86W/mK in all planes.
• NC-809 is Indium Corporation’s first no-clean, ball-attach flux on the market. NC-809 is a dual-purpose flux, engineered with high-tack characteristics for flip-chip applications with strong wetting power for ball-attach applications.

  To learn more about Indium Corporation’s solutions, visit our experts at Productronica India in hall 14, booth H14.B65.

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