MORRISVILLE, NC – iNEMI’s PCB Connector Footprint Tolerance Project investigated industry capability, risks and mitigation strategies associated with high-bandwidth I/O connector footprints. As bandwidth continues to double every three years, the reduction in connector pitch imposes stringent design requirements on PCB fabrication processes. The project team aimed to provide product designers with the information necessary to ensure predictable quality levels when using high-bandwidth connectors. A literature review, along with team experience, helped identify potential risks and create a PCB industry survey to assess supplier capabilities for appropriate quality mitigation.

Join us for this end-of-project webinar where we will review survey results and highlight areas of expectations and gaps between PCB fabricators and connector manufacturers. Additionally, the team will present recommendations for quality assessment and dimension control.

Registration
This webinar is open to industry; advance registration is required. If you have any questions or need additional information, please contact Mark Schaffer (marks@inemi.org).

Monday, September 30, 2024
11:00 a.m. – 12:00 p.m. EDT (Americas)
5:00-6:00 p.m. CEST (Europe)
Register for this webinar

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