WALTHAM, MA – Essemtec is excited to exhibit at the SMTA International Expo, happening October 22-24 at the Donald E. Stephens Convention Center in Rosemont, Illinois. We invite you to visit us at Booth 2959 for live demonstrations of our latest technologies, including our innovative reballing solutions, the all-new Tarantula Underfill system, and the Fox all-in-one machine featuring the new Integrated Inspection System (I2S).
Fox All-in-One Machine:
Experience the Fox all-in-one machine’s impressive versatility and efficiency. This compact powerhouse integrates the Integrated Inspection System (I2S) 2D AOI and 2D SPI capabilities, offering comprehensive inspection and quality control in a single platform. Designed for high-mix production, the Fox supports up to 200 feeder lanes and fits perfectly in space- constrained production areas.
New Tarantula Underfill System:
Discover the Tarantula Underfill system, engineered to deliver superior underfill solutions for a variety of applications. This system enhances reliability and protection for electronic components, especially in high- stress environments. With its non-contact heating capability and adaptability for double-sided populated boards, the Tarantula handles various PCB sizes (up to 560x610mm) and dispensing needs, including solder paste jetting, SMT glue dispensing, LED encapsulation, epoxy dispensing, and more.
Live Demonstrations:
Reballing Solutions:
Watch our advanced reballing technology in action. Our demonstration will cover:
Integrated Inspection System: I2S
See the I2S in action within our Pick-and-Place and Dispensing solutions. This system inspects dispensed and jetted materials, as well as placed SMT components, ensuring only high-quality products enter the reflow ovens. It also features an automated repair function and is already in use at various production sites.
Join us at Booth 2841 during SMTA International to explore these cutting-edge solutions and witness Essemtec’s commitment to advancing SMT technology.