CLINTON, NY – As one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its innovative products at the International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), from October 1-3, in Boston, Massachusetts.

Indium Corporation will showcase the following among its featured products:

• SiPaste® series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance. Indium Corporation’s SiPaste® C312HF is a new formulation offering the same excellent printing performance and material stability over time, with the benefit of having an easily cleanable chemistry with semi-aqueous or saponifier technology.
• PicoShot® NC-6M is a no-clean, halogen-free material specifically formulated to be compatible with Mycronic jetting systems. Chemically compatible with award-winning Indium12.8HF solder paste, PicoShot® NC-6M is optimized for small dot jetting and long-term jetting with Type 6 solder paste. PicoShot® NC-6M offers the smallest dot jetting volume among similar jetting pastes, at 1.6nL/dot. In addition to exceptional jetting performance, its unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues.
• NC-809 is Indium Corporation’s first no-clean, ultra-low residue, ball-attach flux on the market. It is a dual-purpose flux, engineered with high-tack characteristics for flip-chip applications with strong wetting power for ball-attach applications. NC-702A is a no-clean, near-zero residue, halogen-free, and SVHC-free adhesive solution designed for holding chips, dies, or solder preforms in place to prevent skewing and tilting during placement and reflow processes. Its chemical design enables it to hold a die in place during reflow and evaporate out while formic acid is released to enhance soldering. Its halogen-free nature makes NC-702A environmentally friendly, as well. Its near-zero residue feature also makes it compatible with the subsequent molding or underfill processes without the risk of delamination.
• WS-446HF, is a water-soluble, halogen-free, flip-chip dipping flux with an activator system powerful enough to promote good wetting on the most demanding surfaces, including solder-on-pad (SoP), Cu-OSP, ENIG, embedded trace substrates (ETS), and flip-chip on leadframe applications.
• Heat-Spring® solutions, ideal for TIM1.5/TIM2/TIM3 applications, are a compressible, non-reflow metal TIM. These indium-containing TIMs offer superior thermal conductivity over non-metals—with pure indium metal delivering 86W/mK in all planes.
• GalliTHERM®, a portfolio of gallium-based liquid metal solutions, draws on Indium Corporation's more than 60 years of experience in manufacturing gallium-based liquid metals. These liquid metal TIMs are designed for TIM1.5, TIM1, and TIM2 applications. Liquid metal TIMs offer high thermal conductivity for end-product longevity and reliability, low interfacial resistance against most surfaces, ensuring rapid heat dissipation, and extraordinary wetting ability for both metallic and non-metallic surfaces

To learn more about Indium Corporation’s products, visit our experts at IMAPS Boston at booth #321.

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