CLINTON, NY – As one of the leading materials providers in the electronics assembly industry, Indium Corporation® is proud to feature its innovative products and technical presentations at SMTA International (SMTAI), from October 21-24, in Rosemont, Illinois.

Indium Corporation will showcase the following among its featured products:

• Durafuse® LT is an award-winning solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and low-temperature soldering, contributing to a reduced carbon footprint in manufacturing processes. It is ideal for assemblies with large temperature gradient, large CTE mismatch, or components with complex warpage. Durafuse® LT delivers superior drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and even outperforms SAC305 with optimal process setup.
• Durafuse® HR, a proven solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability applications. It also offers reduced solder joint cracking and increased shear strength. Additionally, it empowers automotive and infrastructure applications to achieve extended mission profiles, surpassing the limitations of SAC305 and meeting ever-evolving reliability requirements.
• CW-807RS is a no-clean formula designed to maximize the solderability of a halogen-free cored wire solder flux. The elevated wetting speeds provided by the activator package can provide lower cycle times in manual and robotic soldering processes. The spatter control technology within the flux produces an aesthetically pleasing board post-soldering by leaving minimal spattering and a clear to light-colored residue.

To learn more about Indium Corporation’s products, visit our experts at SMTAI at booth #2300.

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