At Incap Slovakia, quality and efficiency are at the core of our Surface Mount Technology (SMT) production. To further strengthen process control and minimise defects, we have implemented Automated Paste Inspection (API)—a high-precision system that ensures the accuracy and consistency of solder paste printing.

Solder paste printing is one of the most critical steps in SMT assembly, directly influencing component placement and solder joint integrity. Even slight deviations—such as misalignment, insufficient paste volume, or improper deposition—can compromise product quality and lead to costly rework.

We have integrated a dual inspection system, where post-reflow inspection data provides real-time feedback to the paste printing stage. This closed-loop approach enables immediate process adjustments, reducing errors at the source and maintaining the highest quality standards.

Key advantages for our customers:

Superior product quality – precision-controlled solder paste application results in fewer defects.

Reduced scrap and rework – advanced process control minimises material waste.

Reliable and consistent production – real-time monitoring keeps SMT processes within strict tolerances.

Increased competitiveness in EMS – lower defect rates and optimised efficiency contribute to cost-effective manufacturing.

By investing in advanced inspection technology, Incap Slovakia continues to drive excellence in electronics manufacturing, delivering high-quality, reliable solutions to our customers.

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