HANAU, GERMANY – Heraeus Electronics is pleased to announce its participation in the 2025 IPC APEX EXPO, taking place March 18–20, 2025, at the Anaheim Convention Center in Anaheim, California. Attendees can visit Heraeus at Booth 3702 to explore its latest innovative solder paste solutions, including the Microbond® SMT660 Innolot®, SMT650, and SMT712 series. There will also be the new module attach sinter past mAgic® PE360 on display for large area sintering.

Microbond® SMT660 Innolot®: High-performance Solder Paste

SMT660 Innolot® paste stands for highly reliable, high- performance paste with a competitive Total Cost of Ownership (TCO) offering. Innolot® is a well-known alloy, allowing for higher creep resistance, resulting in longer product lifecycles at higher operating temperatures. The SMT660 Innolot® solder paste performs in air without additional N2 during reflow, while keeping defects low, reducing your TCO. This specifically means reduced pin and blowhole behavior, very low BGA voiding and low area voiding.

Microbond® SMT650: High-Reliability Solder Paste

Heraeus Electronics will also showcase the SMT650, designed to meet the needs of miniaturized systems in the automotive industry. This high-reliability solder paste delivers consistently high surface insulation resistance, preventing electrochemical migration. By pairing the new F650 flux system with the Innolot® alloy, the SMT650 provides exceptional performance in challenging applications, enhancing reliability for next-generation devices.

Microbond® SMT712: Excellent General-Purpose Solder Paste

The SMT712 solder paste offers a wide process window and outstanding high-speed printing and wetting properties. Its exceptional ability to minimize head-in-pillow defects during the soldering process makes it an excellent choice for demanding SMT applications across industries.

mAgic® PE360: A new benchmark in Large Area Sintering

A significant challenge in adopting sintering for module attach applications lies in effectively managing large areas. The new mAgic PE360 Silver Sinter Paste tackles this challenge with its superior workability and drying behavior, minimizing voiding in the paste layer. The mAgic PE360 offers enhanced thermal performance compared to traditional soldering methods.

Engineered to deliver a highly reliable joint with exceptional thermal conductivity, this paste overcomes the limitations of conventional soldering techniques. Lead-free and halogen-free, the mAgic PE360 ensures compliance without compromising performance or reliability. Its ability to sinter at very low pressure and temperature levels makes it ideal for sintering finished molded modules, simplifying the manufacturing process compared to conventional sinter pastes for die attach.

Heraeus Electronics is at the forefront of innovation, empowering manufacturers with cutting-edge solutions that meet the dynamic demands of the electronics market. Visitors to Booth 3702 will have the opportunity to engage with Heraeus’ team of experts, explore its wide portfolio, and learn how these products are shaping the future of electronics manufacturing.

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