Indium Corporation Powering Sustainability at APEC 2025
As one of the leading materials providers in the electronics assembly and solder industries, Indium Corporation® is proud to feature its lineup of high-reliability products at APEC 2025, taking place March 16-20, in Atlanta, Georgia.
With a strong focus on power device packaging, Indium Corporation provides advanced material solutions engineered to enhance energy efficiency, optimize thermal management, and support long-term sustainability in electrification applications. A key part of this innovation is Indium Corporation’s Fluxless Assembly Solder Technology (FAST), which enables high-reliability, flux-free soldering solutions tailored for next-generation power electronics.
Indium Corporation will showcase the following among its featured products:
• Award-winning InFORMS® are reinforced solder preforms that improve mechanical strength and produce consistent bondline thickness for superior reliability performance compared to traditional solder preforms, particularly in power module applications.
• InTACK® is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes.
• Indalloy®301LT for Preforms/InFORMS® is a novel Pb-free alloy that enables lower reflow processing temperatures compared to SAC alloys, preventing delamination and reducing warpage in package-attach soldering applications.
• Indalloy®276 is a unique lead-free solder alloy that offers a wide service temperature capability and improved reliability up to 175°C. It has demonstrated high-reliability performance while also being capable at both moderate and high service temperature conditions
• Durafuse® HR, based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
• Durafuse® HT is an innovative Pb-free solution designed to deliver a high-temperature lead-free (HTLF) paste for discrete power electronics devices. Durafuse® HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than a high-Pb solder.
• QuickSinter® is a new approach to sinter technology. This high-metal, low-organic content approach enables fast drying and sintering times for high throughput. Both silver and copper sinter pastes are available. Applications include die-attach and substrate-attach in power electronics. The portfolio includes the InFORCE™ range of pressure sinter pastes:
o InFORCE™29 – a pressure copper sinter paste for high-reliability, high thermal conductivity, die-attach applications; InFORCE™29 features high workability, making it suitable for printing or dispensing applications.
o InFORCE™MF – a pressure silver sinter paste for the highest reliability, highest thermal conductivity, die-attach applications; InFORCE™MF is specially formulated for printing applications, providing low process yield loss due to print defects.
o InFORCE™ LA – a pressure silver sinter paste formulated for sintering of areas greater than 100mm2. Sintering is possible with reduced temperatures and pressure, making it suitable for transferring molded package-attach to cooler applications.
To learn more about Indium Corporation’s power electronics and solder solutions, visit www.indium.com or visit our experts at APEC at booth #404.
About Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
