As a global supplier of solder and thermal interface material (TIM) products, Indium Corporation experts are proud to share their technical insight and knowledge on a variety of industry-related topics at IPC APEX Expo, March 18-20 in Anaheim, California.

Tuesday, March 18

Achieving Lower Voids with a Novel Preform Flux Technology, presented by Research Chemist David Bedner, and co-authored by Lee Kresge, Igor Faleichik, Dan McElhinney, and Dr. Ricky McDonough.

This presentation introduces a next-generation preform flux that significantly reduces voiding in solder joints, enhancing thermal performance and reliability across various applications, with testing demonstrating up to a 67% reduction in voids under optimized reflow conditions.

Wednesday, March 19

Enhancing PCB Reliability: Voiding Reduction Design with a Mixed-Alloy Solder, presented by Technical Support Engineer Thuy Nguyen, and co-authored by Dr. Hongwen Zhang, Dr. Ronald C. Lasky, and Adam Murling.

This presentation explores the development of novel mixed-alloy solder paste Durafuse® HR, which reduces voiding while maintaining high-reliability thermal cycling performance, offering improved solutions for automotive, high-performance computing, and 5G communication applications.

Novel Supercooled Solder Materials for Lower-Than-Liquidus Reflow presented by R&D Manager Dr. Ian Tevis, co-authored by Dr. Yifan Wu and Radhika Jadhav.

This presentation showcases the development of supercooled solder pastes using core-shell bismuth-tin (BiSn) particles, enabling reliable solder interconnects at temperatures 40°C lower than conventional reflow profiles, making them ideal for future electronics manufacturing and temperature-sensitive applications.

Liquid Metal Paste High-Speed Dispensing for High-Volume Manufacturing – Part II, co-presented by Senior Product Specialist Miloš Lazić and Sunny Agarwal, ITW EAE. Co-authored by Dr. Ricky McDonough.

This presentation examines the advancements in liquid metal paste (LMP) technology, showcasing its enhanced thermal conductivity and adaptability for high-performance computing applications, while addressing challenges associated with traditional liquid metal thermal interface materials (TIMs).

Phase-Change Metal (PCM) TIMs for Enhanced Thermal Management – Part II, presented by Miloš Lazić, co-authored by Dr. Ricky McDonough and Bob Jarrett.

This presentation introduces newly developed gallium-based and gallium-free phase-change metal (PCM) TIMs, designed to remain in a liquid state at operating temperature, delivering exceptionally low thermal resistance. Power cycling and HAST data highlight their robust performance and underscore the necessity of containment strategies, while gallium-free solutions enable compatibility with aluminum heat-sinks.

To learn more about Indium Corporation’s solder and TIMs solutions, visit www.indium.com or visit with our experts at APEX 2025 in booth #1416.

About Indium Corporation

Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.

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