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A printing investigation revealed unexpectedly stable and adequate paste transfer levels for metric 0201 components.

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Small-tier manufacturers are typically narrow-focused. Not STI.

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Streamlining governing processes in audit execution and auditor training.

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This study finds a process similar to 0201 parts, with a 100 µm thick stencil and a nitrogen environment.

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A methodology to calculate solder joint height is used to conduct a tolerance analysis on BGAs.

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Silicon Valley’s choice for one-stop shoppers is gaining a national reputation for handling the toughest boards.

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