RICHARDSON, TX – Elcoteq will lay off 96 workers including all its employees in engineering services here, according to reports.
The layoffs will take place between late March 24 and early April 7.
SAN JOSE – The MicroElectronics Packaging and Test Engineering Council has finalized the program for its first-quarter symposium, Semiconductor Packaging – Impacting the Age of Consumer Electronics.
The event will be held Feb. 19 in San Jose.
Ronald Steger, partner-in-charge of global semiconductor practice, KPMG, will keynote the symposium, discussing the consumer electronics boom – how semiconductor and consumer electronics companies can improve cost, time-to-market and product quality.
Other presentation topics include time-to-market and consumer semiconductor packaging; signal integrity: getting it right the first time; modeling package thermal behavior in advanced process technologies; time-to-market is everything; cost-of-ownership challenges for consumer products; a fabless semiconductor's point of view: IC package technology development and the total cost of ownership; an OSAT provider's point of view for consumer applications: IC package development and total cost of ownership challenges; solutions for consumer product miniaturization; STATSChipPAC – evolution of package on package; selecting the right packaging technology: finding the optimum balance between device and system level considerations in consumer applications; trends in low profile packaging; advancing technologies for consumer electronics; new tornado: adoption of MEMS processes by IC industry; microbatteries for integrated autonomous microdevices; the future of MEMS chem-bio sensors, and mobile projection displays based on biaxial scanning MEMS mirrors.
The event will be held Feb. 19 in San Jose.
Ronald Steger, partner-in-charge of global semiconductor practice, KPMG, will keynote the symposium, discussing the consumer electronics boom – how semiconductor and consumer electronics companies can improve cost, time-to-market and product quality.
Other presentation topics include time-to-market and consumer semiconductor packaging; signal integrity: getting it right the first time; modeling package thermal behavior in advanced process technologies; time-to-market is everything; cost-of-ownership challenges for consumer products; a fabless semiconductor's point of view: IC package technology development and the total cost of ownership; an OSAT provider's point of view for consumer applications: IC package development and total cost of ownership challenges; solutions for consumer product miniaturization; STATSChipPAC – evolution of package on package; selecting the right packaging technology: finding the optimum balance between device and system level considerations in consumer applications; trends in low profile packaging; advancing technologies for consumer electronics; new tornado: adoption of MEMS processes by IC industry; microbatteries for integrated autonomous microdevices; the future of MEMS chem-bio sensors, and mobile projection displays based on biaxial scanning MEMS mirrors.
NEW YORK – Dover reported fourth-quarter revenue of $1.7 billion, down 8% from last year, and net earnings from continuing operations of $170 million, down 3%.
TOKYO – The consolidation of Japan’s electronics industry is a must to stay viable, says former Sony Corp. chairman Nobuyuki Idei.
CHELMSFORD, ENGLAND – A 10-page photographic reference guide on counterfeit components is available from Bob Willis.
SANTA CLARA, CA – Intel chairman Craig Barrett will retire from active management in May at the company’s annual stockholders' meeting, the company said today.
Press Releases
- ECD Delivers on Mexico Manufacturing Dynamics; Showcases Time-saving Technology at SMTA Event
- MKS Instruments Releases 2024 Environmental, Social, Governance Report
- Promex Industries and QP Technologies Implement Sales/Marketing Reorganization
- SIA Applauds CHIPS Act Incentives for Amkor Facility in Arizona