Circuits Assembly Online Magazine - Features

SILVER SPRING, MD – The International Electronics Manufacturing Initiative is offering a medical electronics forum on Nov. 14 in Silver Spring, MD.

This free event, hosted by the US Food and Drug Administration, will discuss requirements and recommendations developed for the electronics industry to ensure reliability of components used in medical products.

Forum topics include existing and related standards and test methods; use conditions for life-critical medical components; test and extrapolation methodologies; sampling population assessment; range and conditions of applicability; test methodologies and criteria; medical grade guidelines; failure modes and effects analysis of MLCC failures, and accelerated life test methods to determine long-term leakage and breakdown failures of MLCCs.

TORONTO – Adeptron Technologies will provide $15 million a year in electronics manufacturing services to an undisclosed OEM, the EMS firm said today.

The deal has "the potential to increase significantly," Adeptron said, because of sales growth of the product lines and from possible additional manufacturing support services for other current and future products.

Adeptron said the Canada-based OEM designs a "top-selling range of proprietary technology products that are marketed worldwide." The company indicated the product is used in office and educational environments.

Full ramp of manufacturing is expected to take place during the first quarter 2009.

Adeptron has annual sales of $250 million, including revenues generated by a partner in China.

GLENVIEW, IL – Illinois Tool Works reported third-quarter net income slipped 7.5% even on an 11% jump in revenues, the latter spurred by acquisitions and favorable currency translations. Base revenues fell 0.8% on lower volumes partially offset by higher raw material price recovery.

WASHINGTON, DC – Big industry production fell lower in September than it had since late 1974, largely as a result of hurricanes Gustav and Ike.

The Federal Reserve reported production at US factories, mines and utilities plunged 2.8% last month, in addition to a 1% drop in August.

The Fed estimated hurricane-related disruptions accounted for about 2.25 points of the total drop. In addition, a strike affecting the commercial aircraft industry also was a factor, accounting for around 50 basis points.

Economists originally forecast a September decline of 0.8%.

BANNOCKBURN, IL – The Emerging/Critical Interconnection Technology program will receive $2 million in federal appropriations for 2009, up 60% year-over-year.

The E/CIT program was created in 2002 to strengthen the Department of Defense and the US PCB industry.

Operated by Naval Surface Warfare Center, Crane (IN) Division, E/CIT is designed to ensure the military has the latest technical capabilities, processes and equipment to support war-fighter requirements.

The program facilitates solutions to current military problems and evaluates leading-edge design and manufacturing technologies for future military and commercial requirements.

IPC is among the groups that has advocated for funds for the program.

SMYRNA, GA – UP Media Group Inc. seeks abstracts for PCB Design Conference East 2009, to be held Apr. 27 - May 1 in Waltham, MA.

The event at Westin Waltham Boston includes a one-day exhibition on Apr. 29.

PCB East is a five-day conference focusing on PCB design, engineering and fabrication. The conference is comprised of a three-day technical conference and a professional development certificate program of one- and two-day courses.

Papers and presentations of the following durations are sought for the technical conference: one-hour lectures and presentations, two-hour workshops, and half-day seminars.

Papers and presentations of one-day and two-day tutorials are sought for a professional development certificate program.

Suggested topics include high-speed, high-frequency and signal integrity; component placement; EMI/EMC analysis; thermal analysis; Pb-free processes (especially how they affect design and fabrication); environmental legislation (REACH, RoHS, etc.) and its effects; RF and microwave design; packaging design; mixed-signal design; area arrays; FPGA design and implementation; embedded passives and active devices; flexible circuitry; HDI design and technologies; PCB design/layout basics; component library creation and management; design for manufacture, test and assembly; design (including analog, digital and power supplies); PCB fabrication; surface finishes; industry forecasts, and business and supply chain issues.

Submit abstracts by Nov. 14 at www.pcbeast.com/speakers/abstract.shtml, or email requested information to knargitoth@upmediagroup.com.

If selected, final papers and presentations will be due in March.

Printed Circuit Design & Fab and Circuits Assembly magazines are media partners for the event.

For more information, visit www.pcbeast.com.