More than 15 years ago, the Restriction of the Use of Hazardous Substances in Electronics (RoHS) went into effect with great fanfare. While it had far-reaching effects, the most prominent material affected was lead.

Lead has for decades been the industry’s bad boy. (I’d say red-headed stepchild, but I am still mostly red-headed.) Several attempts were made in the US alone to eliminate its use, and the remediation and eradication efforts for lead in plumbing has had a pronounced effect on lowering rates of birth defects and learning disabilities. While an EU mandate, RoHS had a ripple effect throughout electronics-producing regions, and most eventually migrated to using lead-free materials in electronics solder as well.

As the early RoHS end-use exemptions expired, the number of electronics hardware applications using lead has become limited primarily to legacy high-reliability programs. One of the last holdouts has been the US Department of Defense, and even that pendulum is swinging. The last few US defense appropriations bills have included millions of dollars in funding to support the transition of various aerospace, defense and high-performance electronics to lead-free technologies.

But as we focus on the molecules, are we missing the larger compound? By that I mean the ability to recycle and reuse the materials in electronics products, regardless of their relative toxicity?

ELK GROVE VILLAGE, IL -- SigmaTron today reported revenues for its fiscal third quarter ended Jan. 31 increased 31% to $93.7 million.

MILPITAS, CA — Global fab equipment spending for front-end facilities is expected to jump 18% year-over-year to an all-time high of $107 billion in 2022, marking a third consecutive year of growth following a 42% surge in 2021, SEMI announced today in its latest quarterly World Fab Forecast report.

BERKELEY, CA – Lawrence Berkeley National Laboratory (Berkeley Lab) has developed a method for interconnecting printed circuit boards without requiring soldering or additional components.