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DANDERYD, SWEDEN – Note AB reported first-quarter sales rose 0.5% to SEK 427.3 million, while net profits fell 53% to SEK 5.7 million.
 
For the March quarter, the operating profits fell 44% to SEK 13.8 million on a SEK 10 million restructuring charge. The EMS company turned in an operating margin of 3.2%, down from 5.8% last year. Cash flow from operations was SEK 24 million, down from SEK 45.6 million.
 
During the quarter, Note continued to transfer production to lower-cost countries and cut its headcount in Sweden by more than 150, or roughly 20% of its local workforce. The firm employs 1,200 workers globally.
 
The company also purchased Nearsourcing Centre in the UK, and acquired a domestic mechanical engineering services group.
 

BANNOCKBURN, IL – IPC has released IPC-7095B, Design and Assembly Process Implementation for BGAs.
 
This revised document focuses on applications that use both SnPb and Pb-free on the same board, including various solder ball alloys, new laminate materials for Pb-free, BGA trace escape and routing considerations during board design to improve yield and reduce cost,” explained Ray Prasad, task group chairman.
 
“There is also a detailed discussion of reflow solder profiling, void process indicators and ways to improve product reliability,” he said
 
The standard was approved by consensus last month, said Prasad, who is also principal of Ray Prasad Consultancy Group, in a statement. 
 
 

TEDDINGTON, UK – A new approach adopted by the National Physical Laboratory has led to the design and build of the NPL – IPTM (Interconnect Properties Test Machine), says Dr. Chris Hunt and his team.
 
It applies defined deformation under precision control to measure materials properties. The apparatus permits materials data to be obtained from solder samples that have volumes and geometries similar to those of real solder joints, and from joints loaded in shear, mirroring the practical situation in the field.
 
The instrument reportedly can accommodate various solder alloys and surface coatings, and permits direct microscopic examination during the test at temperatures between -55 to 125°C.
 
A four-point measurement system for resistance monitoring also has been embedded and found to correlate well with structural degradation recorded during fatigue testing of solders, says NPL. The resistance measurement is directly related to the development of a crack; resistance data can be used to predict crack growth rates. The results indicate lifetime can be measured using the load decrease and/or the resistance increase. Measuring these parameters directly, for different solders and conditions, and relating them to real assembly performance, will aid modeling of lifetime prediction for Pb-free solders, says the group.
 
Although the mechanical behavior of Pb-free joints is known to be different from that of conventional SnPb joints, there is a lack of data suitable for modeling purposes; the need to generate such data to evaluate likely Pb-free solder performance has assumed some urgency, according to NPL.