SAN JOSE – The MicroElectronics
Packaging and Test Engineering Council announced its technical symposium
Substrates: The Foundation of Semiconductor Packaging, to be held in San Jose
Nov. 8.
The objective of this symposium is to identify technology requirements for the next generation of substrate technology, highlighting required innovations that will further enable IC component integration, and electronic system functionality.
The program is segmented into the following areas: Substrate Manufacturing and 1st Level Interconnect Technology; Design and Simulation: Silicon, Substrate, System; 2nd Level Interconnect and Reliability, and Emerging Substrate Technologies.
For more information, visit www.meptec.org.
The objective of this symposium is to identify technology requirements for the next generation of substrate technology, highlighting required innovations that will further enable IC component integration, and electronic system functionality.
The program is segmented into the following areas: Substrate Manufacturing and 1st Level Interconnect Technology; Design and Simulation: Silicon, Substrate, System; 2nd Level Interconnect and Reliability, and Emerging Substrate Technologies.
For more information, visit www.meptec.org.
SHENZHEN – Kasion Automation
Ltd. on Sept. 28 celebrated its 15th year in China.
More than 150 people were present, including all employees of Kasion from offices in Beijing, Tianjin, Shanghai, Nanjing, Shenzhen and the company’s Hong Kong headquarters; its subsidiary colleagues; customers Artesyn (Emerson), Celestica, Chung Nam, Computime, Elcoteq, Flextronics, Hasee, Hip Fung, Honeywell, Huawei, Konka, Refined Industry, Sangfei, Vtech, Zastron, and manufacturing suppliers, including Assembleon, BTU, BPM, CASIO, PVA and VJ Electronix.
Abby Tsoi, director of Kasion, kicked off the celebration with a welcome speech and presentation of the Long Service Awards, Excellent Performance Awards and Outstanding Performance Awards for employees.
Stephen Wu, area manager of North China, received awards for 15 years of service and sales performance. Kelvin Sze earned award for sales, and Rebecca Tse received a performance award, in addition to their service gold medals.
More than 20 employees were presented with service and performance awards, while Kasion’s customers and principal manufacturing suppliers received the Excellent Partnership Awards, presented by GM SK Chiu.
More than 150 people were present, including all employees of Kasion from offices in Beijing, Tianjin, Shanghai, Nanjing, Shenzhen and the company’s Hong Kong headquarters; its subsidiary colleagues; customers Artesyn (Emerson), Celestica, Chung Nam, Computime, Elcoteq, Flextronics, Hasee, Hip Fung, Honeywell, Huawei, Konka, Refined Industry, Sangfei, Vtech, Zastron, and manufacturing suppliers, including Assembleon, BTU, BPM, CASIO, PVA and VJ Electronix.
Abby Tsoi, director of Kasion, kicked off the celebration with a welcome speech and presentation of the Long Service Awards, Excellent Performance Awards and Outstanding Performance Awards for employees.
Stephen Wu, area manager of North China, received awards for 15 years of service and sales performance. Kelvin Sze earned award for sales, and Rebecca Tse received a performance award, in addition to their service gold medals.
More than 20 employees were presented with service and performance awards, while Kasion’s customers and principal manufacturing suppliers received the Excellent Partnership Awards, presented by GM SK Chiu.
Kasion has grown more than 10 times since it was established.
SANTA CLARA, CA – The Electronics Supply Chain Association announced Jim Miller of Cisco Systems has been added as a keynote presenter for the 11th Annual Electronics Supply Chain Association Conference, Oct. 29-31, in Santa Clara.
Miller, vice president, product operations, will present Value Creation throughout the Product Lifecycle.
In addition, Paul R. Brody, partner, IBM Global Business Services and Global Lead, Electronics Industry Strategy Practice, will present the opening keynote on Optimization through Collaboration: Going it Alone is No Longer an Option, and Beth McKone, vice president of worldwide program management and supply chain solutions for Solectron Corporation, will present Supply Chain Orchestration – Changing the Game by Changing the Rules.
For more information, visit www.electronicssupplychain.org.
Miller, vice president, product operations, will present Value Creation throughout the Product Lifecycle.
In addition, Paul R. Brody, partner, IBM Global Business Services and Global Lead, Electronics Industry Strategy Practice, will present the opening keynote on Optimization through Collaboration: Going it Alone is No Longer an Option, and Beth McKone, vice president of worldwide program management and supply chain solutions for Solectron Corporation, will present Supply Chain Orchestration – Changing the Game by Changing the Rules.
For more information, visit www.electronicssupplychain.org.
SHENZHEN – Endicott Interconnect Technologies has signed a lease to supply fully assembled boards via a 40,000 sq. ft. facility in Shenzhen. The lease currently covers space for one line, company sources say.
“Once volume production ramps for many boards, it can occur at EI Shenzhen, which offers both a volume production site and lower cost manufacturing,” said Stephen Howland, product manager of EI complex assembly operations.
EI Shenzhen can provide high-density hybrid PCB assemblies – double-sided complex boards with mixed technologies and an average component count of > 1500 – in sizes as large as 8" x 24" for SMT or non-SMT backplanes, the company reports.
Assembly technologies include SMT, press fit, wave solder, selective PTH solder, and hand assembly and solder. Components that can be placed on-board include high I/O area array modules (BGA/CGA down to 0.03" pitch, and PBGA), fine pitch leaded parts, and SMT discretes and chips down to 0402 size, as well as high-density, high-I/O connectors. Complete mechanicals – cage, chassis and system assemblies – can be provided, EI says.
Products for which the Shenzhen facility can provide production include motherboards for servers and communication applications, as well as controller boards for various medical and IT applications.
“Once volume production ramps for many boards, it can occur at EI Shenzhen, which offers both a volume production site and lower cost manufacturing,” said Stephen Howland, product manager of EI complex assembly operations.
EI Shenzhen can provide high-density hybrid PCB assemblies – double-sided complex boards with mixed technologies and an average component count of > 1500 – in sizes as large as 8" x 24" for SMT or non-SMT backplanes, the company reports.
Assembly technologies include SMT, press fit, wave solder, selective PTH solder, and hand assembly and solder. Components that can be placed on-board include high I/O area array modules (BGA/CGA down to 0.03" pitch, and PBGA), fine pitch leaded parts, and SMT discretes and chips down to 0402 size, as well as high-density, high-I/O connectors. Complete mechanicals – cage, chassis and system assemblies – can be provided, EI says.
Products for which the Shenzhen facility can provide production include motherboards for servers and communication applications, as well as controller boards for various medical and IT applications.
WILSONVILLE, OR – Mentor Graphics Corp. chairman and CEO Dr. Wally Rhines will keynote the International System-on-Chip Design Conference in Seoul later this month.
Dr. Rhines’s talk will focus on changing the design rules, the company announced.
The conference runs Oct. 15-16.
For more information, visit http://www.isocc.org/.
Dr. Rhines’s talk will focus on changing the design rules, the company announced.
The conference runs Oct. 15-16.
For more information, visit http://www.isocc.org/.
ELK GROVE VILLAGE, IL – The electronics industry lost one of its more charming personalities last week as Stuart Blankstein, president of ACL Staticide, died following a bacterial infection.
He leaves a wife, Karen, and three children.
Funeral services were held in Skokie, IL.
In lieu of flowers, donations may be made to your charity of choice.
To sign his memorial book, click here:
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