EDINA, MN – The deadline for papers for the SMTA’s Pan Pacific Microelectronics Symposium is July 20.
The symposium will take place in Kauai on Jan. 22-24.
The event focuses on business markets and technologies of microelectronic packaging, interconnection, microsystems technology and assembly. It promotes international technical interchange and provides a forum for networking among microelectronics professionals and business leaders throughout the Pacific Basin.
For more information on submitting a topic for presentation, visit http://www.smta.org/pan_pac/call_for_papers.cfm or contact JoAnn Stromberg, joann@smta.org.
SAN JOSE, CA – The world flat panel displays market is set to exhibit a huge growth during the 2001-2010 period, registering sales in excess of $114.4 billion by 2010, says Global Industry Analysts Inc.
Japan and Asia-Pacific corner the largest share of the global FPD market, with a combined share estimated of more than 75% in 2006, says the firm. Asia-Pacific is forecast to emerge as the fastest growing FPD market with a CAGR of 23.5% during 2001-2010.
The plasma displays market is projected to be the major growth driver with a CAGR of 38.5% over 2001-2010.
Demand for various flat display types will remain bullish in the years ahead, according to Global Industry Analysts. The market researcher claims the demand for displays will come from integration in different end-use applications, including home entertainment systems and mobile phones.
Prices of LCDs and PDPs are sliding because of the huge investments made in fabrication capacities and advanced technologies, bringing in an increased demand for FPDs, the firm states.
LCDs are being increasingly used in notebook computers, desktop computers, cellphones, portable digital assistants and flat panel televisions with broadband compatibility. Leading electronics players including Samsung, Sharp and LG are channeling substantial resources into the production of these displays to suffice the continuously up-surging market demand, says the report.
However, the LCD market could face stiff competition from competitive flat panel displays such as organic light emitting diode (OLED) and field emission display (FED), says Global Industry Analysts.
Recently, small-size LCDs have been in short supply in major FPD markets across the globe, owing to an unprecedented demand for small-size panels in color cellphones apart from shortened supply of the large panels, continues the report.
Large-panel LCDs for desktop and notebook computers are trading at significantly low prices and prices are likely to fall further. Prices of large-area, thin-film-transistor LCDs dropped by significant amounts and are expected to continue dropping until demand recovers sharply.
WASHINGTON, DC – Comments on Korea's RoHS-like regulation via the ‘technical barriers to trade’ process are due July 21.
CHANGCHUN, CHINA – EMS firm Surface Mount Technology (Holdings) Ltd. will invest more than $13 million over the next two years in its newest facility, in Changchun. The 108,000 sq. ft. facility, SMT’s fourth, began operation June 28 and will operate under the name Surface Mount Technology (Changchun) Ltd.
SAN JOSE, CA – North American-based manufacturers of semiconductor equipment posted $1.65 billion in orders in June and a book-to-bill ratio of 0.94, according to SEMI.
The three-month average of worldwide bookings was $1.65 billion. The bookings figure is relatively flat with the final May level of $1.64 billion, and about 7% less year-over-year.
The three-month average of worldwide billings was $1.75 billion. The figure is about 5% greater than May, and about 13% greater than June of 2006.
"North American bookings and billings are trending up slightly, and are at their highest levels of the year," said Stanley T. Myers, president and CEO of SEMI. "Based on SEMI midyear consensus forecast data, we expect the semiconductor equipment market to experience strong sales in 2007 of over $40 billion, driven by investments in 300 mm technology and 45 nm tools."
MILPITAS, CA – Lead-Free Soldering, a hardback book from Solectron Corp., offers a collection of practical techniques for lead-free soldering design and manufacture.
The book includes the latest information on proposed changes to lead-free standards, and up-to-date analysis of government and legislative activities and regulations in North America, Europe and Asia.
Written by recognized experts in both academia and industry, Lead-Free Soldering is a guide for practicing engineers interested in the latest developments surrounding areas such as lead-free alloy properties, reflow, wave, rework, solder joint reliability, PCB laminates and surface finishes, and backward and forward compatibility.
To purchase the text for $129, email orders-ny@springer.com.
