EL SEGUNDO, CA – Total semiconductor shipments in Greater China—consisting of Mainland China, Hong Kong and Taiwan—totaled $66.3 billion in 2006, up 11.8% from 2005, according to iSuppli Corp.
WASHINGTON, DC – U.S. high-tech goods exports increased by 10% to $220 billion, while imports rose by 9% to $322 billion between 2005 and 2006, according to AeA's first edition of “Trade in the Cyberstates 2007.”
ROME, NY – The ESDA’s annual EOS/ESD symposium will take place at the Disneyland Hotel in Anaheim, CA, Sept. 16 – 21.
This year’s featured plenary speaker, Allan Johnston, principal engineer at the Jet Propulsion Laboratory, will present Space Radiation in Advanced Semiconductor Devices on Sept. 18.
More than 30 tutorials will include topics such as ESD basics for program manager, ESD on-chip protection in advanced and RF technologies, air ionization, EOS/ESD failure models and mechanisms, in-plant ESD survey and evaluation measurements, CDM design and characterization, and more. Also offered is the two-day S20.20 seminar on developing and implementing an ESD control program.
New tutorials include ESD Circuits, ESD Ignition & Fires, Methodologies for Determining the Impact of Static Control Methods, Perfect ESD Storm, Advanced Topics in TLP Testing, Electrical Fields – Practical Considerations for the Factory, Electrostatic Attraction, Automated Handling Processes, and Advanced ESD/EMI/EOS Auditing Techniques.
More than 50 technical sessions from international authors will address such issues as device testing, ESD-RF design considerations, factory/materials, system-level testing, and more.
Ten workshops will be offered, including ESD Control and Design for Extremely Sensitive Devices, Cleanrooms ESD Ionization Guidelines and Considerations, Future of ESD Standards and System Test, and Protecting High Frequency Circuits.
Credit can be earned during tutorials for ESD Certified Professional-Device/Design and ESD Certified Professional-Program Manager; these tests will be offered during the symposium. Visit www.esda.org/certification.html for more information.
The symposium includes an exhibition, a welcome reception, an awards breakfast, a professional and technical women’s reception, an attendee lunch, and the ESD Association annual meeting and luncheon.
The deadline for early registration is July 27. For symposium registration information and to download a complete symposium program, visit www.esda.org/symposia.html.
TAIPEI – Hon Hai, Taiwan's top electronic parts maker, is likely to buy part of the stake Philips wants to sell in South Korea's LG.Philips LCD, local newspapers reported.
Economic Daily News said the move could help Innolux Display, a screen maker that assembles LCD monitors under the Hon Hai group, secure more panels.
Hon Hai officials were not available for comment.
Dutch company Philips Electronics owns about a one-third stake in LG.Philips LCD, the world's No.2 LCD maker, worth about $5.4 billion at current market prices, according to Reuters data.
Philips has said it plans to sell at least part of its stake in LG.Philips once its ownership lockup expires this month.
Japan's Matsushita and Toshiba have also been mentioned as possible candidates to buy Philips' shares.
Earlier this week, the head of LG.Philips LCD said Philips is unlikely to sell its stake in the market, although such a transaction could not be ruled out.
SEOUL – Samsung Electronics’ second-quarter net profit fell 5% year-over-year, says its quarterly report. And profits were down 11% from the first quarter, driven in part by DRAM price decline.
FRANKLIN, MA – Speedline Technologies will present a Webcast on reduction/elimination of two common SMT defects: tombstoning and mid-chip solder balls. The one-hour presentation takes place Aug. 16 at 11 a.m. EDT.
The Webinar will review some of the studies and experiments conducted to determine and eliminate the causes of tombstoning. Specific areas of analysis will include solderability, paste volume, placement issues, and pad surface area/design criteria.
Topics to be reviewed in discussing mid-chip solder ball elimination will include stencil design, board design, reflow profile development, component placement accuracy, and solder paste printing.
To register, visit www.speedlinetech.com/seminars.
The Webinar will review some of the studies and experiments conducted to determine and eliminate the causes of tombstoning. Specific areas of analysis will include solderability, paste volume, placement issues, and pad surface area/design criteria.
Topics to be reviewed in discussing mid-chip solder ball elimination will include stencil design, board design, reflow profile development, component placement accuracy, and solder paste printing.
To register, visit www.speedlinetech.com/seminars.
