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EL SEGUNDO, CA – Global revenue for large-sized (10" or greater) LCD panels will rise to $66 billion this year, up 22.2% from 2006, says iSuppi Corp. This represents a 6% increase compared to iSuppli’s previous forecast.
 
iSuppli raised its forecast for large LCD shipments, citing rising demand, tightening supply and increasing prices.
 
Worldwide shipments are forecast to reach 353.8 million units, up 25.2% year-over-year. iSuppli previously predicted shipments of 350.1 million units.
 
Demand is rising from the major markets for such panels: televisions, desktop monitors and notebook PCs, says the research firm. Meanwhile, inventories remain under control. This combination of rising demand and constrained supply is causing overall panel prices to increase, says iSuppli.
 
This strength should continue during the coming years, says the company. The large LCD panel market is expected to expand to 597.6 million units by 2011, up 2% from iSuppli’s previous forecast. Revenue will reach $102 billion in 2011, up 6% from the prior prediction. This will mark the first year the global large-sized LCD panel market will exceed $100 billion, says the firm.
 
iSuppli has upgraded its forecast of global large-sized LCD-TV panel shipments in 2007 to 77.5 million units. The firm predicts LCD-TV panel shipments will rise to 180.45 million units in 2011, up 5% from the previous forecast.
 
The price gap has closed between 32-inch and 40/42-inch panels, which will contribute to higher consumer adoption rates of 40-inch and larger LCD TVs, says iSuppli.
 
A strong recovery in the desktop PC monitor market in the second and third quarters is expected to drive sales to 163.2 million units this year, up 14% year-over-year.
 
The notebook PC LCD panel market is expected to reach 99.6 million units in 2007 and 161.5 million units in 2011, driven by lower prices, the rise of wireless capabilities in portable computers and the shift to larger display sizes, says iSuppli.
 
FRANKLIN, MASpeedline Technologies president Pierre de Villemejane will leave the equipment maker July 18. Joe Hahn, electronics group vice president for parent company ITW, was named interim executive while a permanent replacement is sought.

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OOSTERHOUT, THE NETHERLANDS – Vitronics Soltec will relocate volume manufacturing of several product lines from The Netherlands to its facilities in China and the U.S. over the next six to nine months.

The move is a response to the demand for better price-to-performance ratios, the company said.
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YAVNE, ISRAELOrbotech Ltd. today updated its 2007 revenue forecast for flat panel display inspection equipment to about $50 million, approximately $35 million less than previously anticipated.

About $20 million worth of sales will come in the second half, the company said in a statement today.

After the first quarter, the company indicated it expected a downturn due to lower spending by FPD manufacturers. This downturn is now estimated to be deeper than previously anticipated, as LCD manufacturers delay scheduled “move in” dates for new fabrication facilities to mid-2008, Orbotech said.

The company expects strong rebound in FPD revenues in 2008, based on forecasts for strong second-half bookings and “significant indications” of a substantial upturn next year.

WILLOW GROVE, PAManncorp is offering qualified visitors to www.smtsolderpaste.com a free 250g jar of solder paste.
 
Four choices are offered: no-clean Pb-free, Pb-free water soluble, and Pb no-clean and water soluble. The free sample is available to any legitimate user of solder paste. Limit one per company.
 
CEO Henry Mann anticipates major market penetration of its solder pastes. Manncorp distributes Shenmao solders throughout North America. 
BINGHAMTON, NY – The Unovis Solutions Area Array Consortium gathered in June for a detailed review of this year’s research tracks.

Progress reports were presented on efforts to understand the complex microstructures of Pb-free solder joints and their impact on reliability. Issues pertaining to the reliability of printed circuit materials and designs, as well as QFN and FCBGA assembly and underfilling, were also discussed.

More than 80 attendees from 30 member companies and institutions joined in the two-day workshop.

Led by Dr. Peter Borgesen, the advanced electronic assembly research consortium, formerly run under Universal Instruments, tackles materials and microstructure-related reliability issues critical to high-quality electronics assembly.
 
Members can join the consortium any time and have access to the body of knowledge amassed through its efforts during the past 15 years.

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