Marlborough, MA -- Software simulation company Flomerics has released a survey highlighting the conflict that often occurs between meeting thermal, electromagnetic compatibility (EMC) and signal integrity (SI) design requirements in new PCB designs. 59% of respondents agreed that thermal and EMC requirements are usually in conflict in PCB design (23% disagreed). 60% agreed that thermal and SI requirements are usually in conflict in PCB design (23% disagreed).
However, the survey reveals positive communication and collaboration between electronic and mechanical design engineers at most companies. 64% of respondents described communication as “good” or “very good”, 31% as “needs to improve” and just 4% as “very poor”. 56% of respondents stated that “better software interfaces between electronic and mechanical software would greatly improve collaboration between electronic design engineers and mechanical design engineers”, while 28% said “software is not the issue - good management, human interaction, etc. are more important”.
Respondents were also asked to identify the percentage of new designs that overran time and cost budgets, and the most common causes of such overruns. Most respondents (50%) said that 10 to 30% of new PCB designs overran time and cost budgets, while 4% said projects went over time/budget more than half the time. The most common causes of time and budget overruns were: design requirement changes (59%); circuit design (39%); thermal problems (34%); EMC problems (32%); SI problems (30%); physical layout problems (22%); and routing problems (19%). Respondents were allowed to specify more than one cause.
The survey also provides insights into typical PCB design flows and processes. The average design cycle time for a new PCB design from concept to final testing and manufacturing signoff was specified at 6 to12 weeks by 50% of respondents, more than 12 weeks by 29% and less than 6 weeks by 21%. When asked what generates the greatest pressure on the PCB design function, 54% said “functionality and performance”, 30% said “time to market” and 14% said “cost”.
For a copy of the survey, visit www.flomerics.com/contact.
However, the survey reveals positive communication and collaboration between electronic and mechanical design engineers at most companies. 64% of respondents described communication as “good” or “very good”, 31% as “needs to improve” and just 4% as “very poor”. 56% of respondents stated that “better software interfaces between electronic and mechanical software would greatly improve collaboration between electronic design engineers and mechanical design engineers”, while 28% said “software is not the issue - good management, human interaction, etc. are more important”.
Respondents were also asked to identify the percentage of new designs that overran time and cost budgets, and the most common causes of such overruns. Most respondents (50%) said that 10 to 30% of new PCB designs overran time and cost budgets, while 4% said projects went over time/budget more than half the time. The most common causes of time and budget overruns were: design requirement changes (59%); circuit design (39%); thermal problems (34%); EMC problems (32%); SI problems (30%); physical layout problems (22%); and routing problems (19%). Respondents were allowed to specify more than one cause.
The survey also provides insights into typical PCB design flows and processes. The average design cycle time for a new PCB design from concept to final testing and manufacturing signoff was specified at 6 to12 weeks by 50% of respondents, more than 12 weeks by 29% and less than 6 weeks by 21%. When asked what generates the greatest pressure on the PCB design function, 54% said “functionality and performance”, 30% said “time to market” and 14% said “cost”.
For a copy of the survey, visit www.flomerics.com/contact.
Framingham, MA – In a recent report from Manufacturing Insights, supply chain research director Bob Ferrari identifies intellectual property protection and supplier strategies as the top two risk areas facing manufacturing and retail executives with operations in China. Other risk areas include logistics and transportation, infrastructure, and national as well as local political events.
Ferrari authored the report, which is based on the results from MI’s annual Low Cost Manufacturing in China survey.
Ferrari authored the report, which is based on the results from MI’s annual Low Cost Manufacturing in China survey.
Kunshan, China -- Nanya PCB will invest around $613 million to expand PCB materials production capacity of its plant in Kunshan, Jiangsu Province, China, DigiTimes reported.
The company will expand capacity for producing glass yarn and glass fabric by 40,000 tons and 9 million sq. m., respectively, the paper said. Nanya is also expected to soon finish the second-stage capacity expansion at the plant, with the CCL (copper-clad laminate) capacity to exceed that of the company's Taiwan operations by the first half of 2007.
The company will expand capacity for producing glass yarn and glass fabric by 40,000 tons and 9 million sq. m., respectively, the paper said. Nanya is also expected to soon finish the second-stage capacity expansion at the plant, with the CCL (copper-clad laminate) capacity to exceed that of the company's Taiwan operations by the first half of 2007.
ARLINGTON, VA – Electronic component orders were flat in July, marking the second consecutive month that the 12-month average showed little or no gain (compared to 2005). The four-to-five-week index, which shows order fluctuations over a 10-year period, was down according to the monthly report compiled by the Electronic Components, Assemblies & Materials Association (ECA).
“We’re pretty much in a holding pattern,” said Bob Willis, ECA president. “The fact that the four-to-five-week index is down is more indicative of a strong month last July compared to 2004 than any significant development last month. The flat 12-month moving average probably reflects a wait-and-see attitude among manufacturers based on uncertainty over the current economic and political climate.”
“We’re pretty much in a holding pattern,” said Bob Willis, ECA president. “The fact that the four-to-five-week index is down is more indicative of a strong month last July compared to 2004 than any significant development last month. The flat 12-month moving average probably reflects a wait-and-see attitude among manufacturers based on uncertainty over the current economic and political climate.”
NEW YORK -- EMS sales from the North American automotive industry are likely
to grow from $1.1 billion in 2005 to $3.1 billion by 2012, according to Frost & Sullivan.
The uptick is due to greater outsourcing of certain key operations and a higher amount of electronic content
to grow from $1.1 billion in 2005 to $3.1 billion by 2012, according to Frost & Sullivan.
The uptick is due to greater outsourcing of certain key operations and a higher amount of electronic content
EDINA, MN -- The SMTA will be hosting a job center during SMTAI, held in conjunction
with Assembly Technology Expo on Sept. 26-28 in suburban Chicago. The job center is soliciting local and national companies for job openings in the
electronics manufacturing and supply industry.
The SMTA is providing booth space and a listing of jobs available. Potential employees will be matched to the jobs available and will be given copies of job descriptions and company contact information.
The job center will provide your company the opportunity to reach a region rich in high technology and electronics industry professionals. Examples of SMTAI and ATExpo attendee primary job functions are:
The SMTA is providing booth space and a listing of jobs available. Potential employees will be matched to the jobs available and will be given copies of job descriptions and company contact information.
The job center will provide your company the opportunity to reach a region rich in high technology and electronics industry professionals. Examples of SMTAI and ATExpo attendee primary job functions are:
- Administration
- Circuit/Systems Packaging Design, Circuit Design
- Engineering Management
- Engineering Support (Field Engineering, Technicians)
- Production, Manufacturing, Process Engineering
- Quality Control/Quality Assurance, Production Testing
- Research & Development
- Sales and Marketing.
- Company Name
- Job Title and Short Job Description
- Job Function (see list above)
- Number of Openings
- Company Contact Information (name, phone, email address)
- Preferred Method of Contact (mail, email, phone call).
Press Releases
- Surf-Tech Manufacturing Corp. Ensures World-Class Quality with Advanced Conformal Coating Services
- Luminovo Partners with Sluicebox to Offer an Industry-First Instant Product Carbon Footprint for Electronics
- The Assembly Show and SMTAI Announce Colocation in October
- SIA Applauds CHIPS Act Incentives for GlobalWafers Projects in Texas and Missouri