-SAN JOSE – NanoNexus CEO Dr. William Bottoms will keynote MEPTEC's IC Packaging and Test Roadmaps symposium next month.
The MEPTEC (the MicroElectronics Packaging and Test Engineering Council) event will be held Nov. 16, at the in San Jose.
Dr. Bottoms is chairman and CEO of NanoNexus, a provider of advanced contactor and interconnect products. He is also chairman of the technology working group for Assembly and Packaging of the International Technology Roadmaps for Semiconductors, and has chaired a number of government committees on industry roadmaps.
According to Dr. Bottoms, the large industry poadmap activities including ITRS, JISSO and iNEMI all share one core element: The transistor is no longer the limiting factor in cost or performance of electronic products.
Moore’s law scaling is nearing its end and assembly and packaging innovation is taking up the slack. New materials, new architectures and innovation in packaging and interconnect technologies are emerging. Driven by a consumer-dominated industry, assembly and packaging innovation will make a greater contribution to progress over the next decade than IC innovation. In his keynote presentation, Dr. Bottoms will share his views of how this progress, supported and enabled by the roadmap activities and the industry-wide cooperation they represent, is a foundation of our continued technical progress and growth.
For more info, visit meptec.org.
The MEPTEC (the MicroElectronics Packaging and Test Engineering Council) event will be held Nov. 16, at the in San Jose.
Dr. Bottoms is chairman and CEO of NanoNexus, a provider of advanced contactor and interconnect products. He is also chairman of the technology working group for Assembly and Packaging of the International Technology Roadmaps for Semiconductors, and has chaired a number of government committees on industry roadmaps.
According to Dr. Bottoms, the large industry poadmap activities including ITRS, JISSO and iNEMI all share one core element: The transistor is no longer the limiting factor in cost or performance of electronic products.
Moore’s law scaling is nearing its end and assembly and packaging innovation is taking up the slack. New materials, new architectures and innovation in packaging and interconnect technologies are emerging. Driven by a consumer-dominated industry, assembly and packaging innovation will make a greater contribution to progress over the next decade than IC innovation. In his keynote presentation, Dr. Bottoms will share his views of how this progress, supported and enabled by the roadmap activities and the industry-wide cooperation they represent, is a foundation of our continued technical progress and growth.
For more info, visit meptec.org.
NASHVILLE -- Specialty chemicals company Kyzen Corp. reported third-quarter revenues increased 43% to a record $2.36 million from a year ago.
Net income rose to a record $282,478, versus $62,705 last year.
Net income rose to a record $282,478, versus $62,705 last year.
Year-to-date through Sept. 30, 2006, revenues are up 25% to $6.36 million and net income is up 155% to $527,498. Both are records.
JUAREZ -- Flextronics has begun construction on a plant in Juarez, its third in Mexico, according to various media reports. The company expects the factory to open this month, an analyst who spoke with the company told Circuits Assembly.
Electronicosonline.com, a Mexican online publication, reported that Flextronics would invest $25 million on the 430,000 sq. ft. plant. Construction reportedly began in August, the publication said. About 300,000 sq. ft. of the new site would be dedicated manufacturing floor space.
Electronicosonline.com, a Mexican online publication, reported that Flextronics would invest $25 million on the 430,000 sq. ft. plant. Construction reportedly began in August, the publication said. About 300,000 sq. ft. of the new site would be dedicated manufacturing floor space.
LOUISVILLE, KY -- Sypris Solutions today reported revenue fell 10.5% to $126 million for its third quarter compared to a year ago. The company reported a net loss of $800,000, down from a profit of $3 million. Most of the problems stemmed from the company's industrial and electronics groups.
Electronics' sales fell on a launch delay of a new classified program for the U.S. Government. That program is now expected to reach full ramp in 2007, said Jeffrey T. Gill, president and chief executive.
Electronics' sales fell on a launch delay of a new classified program for the U.S. Government. That program is now expected to reach full ramp in 2007, said Jeffrey T. Gill, president and chief executive.
JACKSON, MI -- Electronics manufacturing services provider Sparton Corp. reported first quarter 2007 sales rose 29% to $48.3 million but the net loss widened 92% to $2.5 million versus last year.
Sales were stronger in all segments except government, which declined significantly due to several unsuccessful sonobuoy drop tests. The failed tests incurred higher program costs and resulted in lost contracts, Sparton said.
LAKE TAHOE, CA – The ESD Association seeks abstracts for the International Electrostatic Discharge Workshop next May in California.
The workshop will focus on robust design and test of ESD protection for state-of-the-art integrated circuits, advanced semiconductor system on chip, and system in package applications. This event is closely aligned with the association’s EOS/ESD Symposium.
Presentation proposals are sought on novel design concepts, special custom design approaches, technology integration issues, failure analysis, test structures, simulation tools, ESD testing, ESD characterization, system level ESD issues, or unresolved issues.
The workshop takes place May 14-17, at the Stanford (CA) Sierra Conference Center. Abstracts are due Nov. 17.
For more information, visit www.esda.org.
The workshop will focus on robust design and test of ESD protection for state-of-the-art integrated circuits, advanced semiconductor system on chip, and system in package applications. This event is closely aligned with the association’s EOS/ESD Symposium.
Presentation proposals are sought on novel design concepts, special custom design approaches, technology integration issues, failure analysis, test structures, simulation tools, ESD testing, ESD characterization, system level ESD issues, or unresolved issues.
The workshop takes place May 14-17, at the Stanford (CA) Sierra Conference Center. Abstracts are due Nov. 17.
For more information, visit www.esda.org.
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