Jena, Germany – GÖPEL electronic will partner with PTS (Production Test Systems Ltd), headquarted in Shenzhen. PTS becomes the 11th Center of Expertise (COE) in GÖPEL’s electronic Alliance Partner Network (created to support JTAG/Boundary Scan applications).
PTS will offer customers in China, Taiwan, Singapore, the Philippines and Malaysia services,such as Design for Testability (DFT), test program generation development and generation, as well as turnkey solutions and complete system integration based on the recently introduced Scanflex platform.
PTS will offer customers in China, Taiwan, Singapore, the Philippines and Malaysia services,such as Design for Testability (DFT), test program generation development and generation, as well as turnkey solutions and complete system integration based on the recently introduced Scanflex platform.
Minneapolis, MN -- The SMTA International Technical Committee is asking for abstracts for the 2006 conference. Short course descriptions are also being solicited. The deadline for abstracts is Feb. 24, 2006; the SMTA International show is set for Sept. 24-28 in Rosemont, IL.
Sumit abstracts online here: smta.org/smtai/call_for_papers.cfm.
Paper are being solicited in emerging technologies, components, assembly, PCB technology, process control and business issues. Visit the Website for further specifics.
BANNOCKBURN, IL – A group of leading solder vendors today issued a statement asserting “no evidence” exists demonstrating voiding has “any significant impact” on solder joint reliability.
In a statement, Karl Seelig, chair of the subcommittee that issued the report, stressed its findings on Pb- free voids. “Based on the comparison of the number and size of solder joint voids to thermal cycle interconnection failure date, there is no evidence that solder joint voiding has any significant impact on solder joint reliability."
San Francisco, CA - Design Chain Associates and EPTAC Corp. will continue its one-day seminar series, "Thriving in a RoHS/WEEE Environment," throughout the U.S. in 2006.
The seminar will cover the EU directives and add all new information on this continuously evolving issue, including insights into new alloys, explanations of China RoHS, supplier updates, reliability updates and more.
This seminar is designed for OEMs, distributors, contract manufacturers and outsource design and manufacturing firms. It is geared toward executive management that needs to determine strategic direction as well as anyone involved in the implementation and execution of the required changes to conform and thrive. Teams are urged to attend since environmental compliance impacts many groups.
The course will provide information in seven fundamental areas impacted by the environmental laws, including EU's Thematic Strategies to Japan's new legislation; business environment; resources; business processes; DfE; manufacturing processes; and equipment.
Future dates include:
San Diego February 14
San Jose February 16
Boston March 7
Atlanta March 9
Austin April 11
Dallas April 13
Minneapolis May 4
Chicago June 8
The seminar will cover the EU directives and add all new information on this continuously evolving issue, including insights into new alloys, explanations of China RoHS, supplier updates, reliability updates and more.
This seminar is designed for OEMs, distributors, contract manufacturers and outsource design and manufacturing firms. It is geared toward executive management that needs to determine strategic direction as well as anyone involved in the implementation and execution of the required changes to conform and thrive. Teams are urged to attend since environmental compliance impacts many groups.
The course will provide information in seven fundamental areas impacted by the environmental laws, including EU's Thematic Strategies to Japan's new legislation; business environment; resources; business processes; DfE; manufacturing processes; and equipment.
Future dates include:
San Diego February 14
San Jose February 16
Boston March 7
Atlanta March 9
Austin April 11
Dallas April 13
Minneapolis May 4
Chicago June 8
Bolton, MA -- DownStream Technologies opened its new corporate headquarters in Marlborough, MA. Located in region’s high-tech corridor along Rte. 495, the facility will house the company’s financial, marketing, sales and R&D operations.
“With the introduction of our newest product, BluePrint for PCBs and the increase in sales of our industry-standard CAM350, it became apparent that we needed to expand in order to accommodate the growth of the company,” said Rick Almeida, founder of DownStream. “Our new facility is optimally equipped to help us respond to the needs of our customers, as well being ideally located so we can continue to attract the best talent in the high-tech industry.”
The new facility allows the company to add engineering and support personnel.
The new address is:
DownStream Technologies, LLC
225 Cedar Hill Street, Suite 33
Marlborough, MA 01752
(508) 970-0670
“With the introduction of our newest product, BluePrint for PCBs and the increase in sales of our industry-standard CAM350, it became apparent that we needed to expand in order to accommodate the growth of the company,” said Rick Almeida, founder of DownStream. “Our new facility is optimally equipped to help us respond to the needs of our customers, as well being ideally located so we can continue to attract the best talent in the high-tech industry.”
The new facility allows the company to add engineering and support personnel.
The new address is:
DownStream Technologies, LLC
225 Cedar Hill Street, Suite 33
Marlborough, MA 01752
(508) 970-0670
PALO ALTO -- SiliconPipe received the Frost & Sullivan 2005 Excellence in Technology Award in the field of system-level interconnect solutions for its Novias technology. The technology is based on the removal of performance-limiting and expensive plated vias from the interconnection channel.
The technology was developed to create stair step interconnections among IC packages, interconnection substrates and connectors. Prototypes have already been introduced and it will soon be incorporated in products.
"SiliconPipe interconnection technologies enable product and system designers to use simple I/O buffers to send signals well beyond 2 Gbps," says F & S research analyst Sivakumar Muthuramalingam. "The company's innovations in interconnect technologies cover the entire spectrum of electronic assembly from their simple, cost-effective Stair Step Packaging (SSP) for ICs to low cost, high performance, backplane connectors used in PCBs."
"SiliconPipe's unique and novel solutions leverage existing manufacturing infrastructure and cost reductions and performance gains are achievable with relatively simple modifications to current design and manufacturing practices," notes Muthuramalingam. "Since these interconnection channels will operate at frequencies that are well beyond today's requirements, current products that incorporate these 'clean' interconnections could offer advantages of lower power consumption and better scalability."
The technology was developed to create stair step interconnections among IC packages, interconnection substrates and connectors. Prototypes have already been introduced and it will soon be incorporated in products.
"SiliconPipe interconnection technologies enable product and system designers to use simple I/O buffers to send signals well beyond 2 Gbps," says F & S research analyst Sivakumar Muthuramalingam. "The company's innovations in interconnect technologies cover the entire spectrum of electronic assembly from their simple, cost-effective Stair Step Packaging (SSP) for ICs to low cost, high performance, backplane connectors used in PCBs."
"SiliconPipe's unique and novel solutions leverage existing manufacturing infrastructure and cost reductions and performance gains are achievable with relatively simple modifications to current design and manufacturing practices," notes Muthuramalingam. "Since these interconnection channels will operate at frequencies that are well beyond today's requirements, current products that incorporate these 'clean' interconnections could offer advantages of lower power consumption and better scalability."
The award is presented yearly to the company that has pioneered the development and introduction of an innovative technology into the market; a technology that has either impacted or has the potential to impact several market sectors.
Press Releases
- Surf-Tech Manufacturing Corp. Ensures World-Class Quality with Advanced Conformal Coating Services
- Luminovo Partners with Sluicebox to Offer an Industry-First Instant Product Carbon Footprint for Electronics
- The Assembly Show and SMTAI Announce Colocation in October
- SIA Applauds CHIPS Act Incentives for GlobalWafers Projects in Texas and Missouri