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TORONTO -- A top executive at Celestica Inc. on Monday suggested to an investor conference that a large acquisition is possible in the company's future.

Celestica treasurer Paul Nicoletti said the EMS firm sees "pretty sizable" opportunities, telling the audience, "I would say right now the opportunities, call it organic-slash-acquisition, are as high now as they've been over the last couple of years."

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ATLANTA -- In his blog today, Dr. Brian Toleno of Henkel reminds users to profile adhesives and underfills as they would solder pastes.

Click here to read: http://circuitsassembly.com/blog/?p=16
Westford, MA and Munich, GermanyZuken and Lockheed Martin have signed a long-term contract for PCB design/ECAD (electronic computer aided design) tools. Zuken was also recently selected as the Preferred Supplier for ECAD by the PCB Design Solutions Engineering Process Improvement (EPI) Program's Electrical Subcouncil, which represents all of Lockheed Martin's businesses.

 
Zuken's scalable enterprise-wide PCB design solution, CR-5000, is at the core of the contract, along with Signal Integrity design tool suite, CR-5000 Lightning.

BRUSSELS – Valor Computerized Systems has implemented its DFM software at Siemens Bocholt in Germany, the company said today.

In a press release, Siemens said it chose the Valor tool for its extensive DfM analysis and checking capabilities. “We also wanted to improve data management and bidirectional communication with our bare board manufacturer.” The tool has cut setup time and costs and improved handling of manufacturing change orders.

Valor’s DFM software is based on Enterprise 3000 and simulates production from design through manufacture to assembly. Designs are optimized using a physical design model of the PCB assembly to reduce revision spins.

 

 

 

MINNEAPOLIS -- The SMTA and Auburn University seek abstracts for the Harsh Environment Electronics Workshop a two-day program that will focus on assemblies, semiconductor technology, substrates, connectors and lead-free products for use in automotive, space, military and avionics.

Abstracts of 200-300 words should focus on the latest developments, state-of-the-art technology and trends. The deadline is March 22.

The event will be held July 19-20 in Indianapolis.

Contact: conference coordinator Melissa Serres at melissa@smta.org.
UTICA, NY -- Indium Corp. vice president of technology Dr. Ning-Cheng Lee will emphasize reliability in a presentation to be delivered at the Intel Lead-Free Symposium in Scottsdale, AZ, next week.

Dr. Lee’s presentation will depict a supplier’s perspective on the impact and challenges for next-generation flux and paste in drop-critical applications.

Dr. Lee will look at flux and paste formulation directions, expected challenges, assembly implications and challenges, and the shift to using Pb-free fluxes.

Dr. Lee is a renowned expert on soldering and frequent lecturer.

The symposium takes place March 15-16.

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