ULT 200.1 is for removal of laser and soldering fumes, dusts, gases, odors and vapors.
UVCL-P and UVCL-X UV cure coatings feature a single-component, medium-low viscosity, dual-cure coating with secondary moisture cure for cure in shadow areas.
HM520 modular pick-and-place chip mounter is 890mm long and comes with 80,000cph rotary head and 60,000cph piano head, or 72,000cph rotary head for LEDs.
Almit ROL0 Pb-free cored solder wire for high-reliability applications increases and accelerates wetting to cut cycle time and preserve solder-joint quality.
MR-NH non-halogen solder paste releases easily from small apertures to allow printing on 0201-size pads with conventional 150µm stencils.
Press Releases
- Koh Young Honored by Foxconn with 2024 Digital Ecosystem Partner Award
- SIA Applauds Finalization of CHIPS Investments for Intel Manufacturing Projects
- Spectrum Advanced Manufacturing Technologies Named Manufacturing Partner for D-Orbit USA
- Absolute EMS Enters Strategic Partnership with PTEC Solutions to Enhance End-to-End Electronics Manufacturing Capabilities