Heatwave software is a pictorial representation of an assembly that is updated in real-time as failures are reported to the manufacturing execution system.
G Series XRF is for analysis of precious metals, tin and nickel on PCBs, wafers, connectors and other electronic components.
Smart reflow process inspection (RPI) data analytics have been integrated into iTAC.MES.Suite.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing