Model XSDC 601 solder paste storage controls temperature and has Industry 4.0 traceability.

TS8100-200 positive displacement PC pump has higher output than TS8100-100.

MasterSil 157 two-component silicone system features low viscosity and low exotherm. It has superior electrical insulation properties and can cure in sections beyond 1" thick. Is serviceable over temperature range of -175° to +500°F (-115° to +260°C). Formulated for applications requiring a silicone to operate under low temperatures. Elongation of 110-140%, refractive index of 1.43, excellent optical clarity, and transmits light from 220-2,500nm. Addition cured system does not require exposure to air for complete cross-linking. Mix ratio is 10:1 by weight and will not outgas while curing. Pot life of 2-4 hr. at room temperature for a 100g mass. Can be used to encapsulate LEDs and for optoelectronic and specialty OEM products.

Master Bond

www.masterbond.com/applications/potting-and-encapsulation

DataMan 70 series delivers high read rates for 1D and 2D label-based barcodes in a compact fixed-mount form factor small enough to fit in the palm of a hand.