ISO-Spector S2 5D SPI features patented third-generation sensor technology said to enable unique, simultaneous 2D and 3D inspection.
BH (3.96mm pitch) and BK (5.08mm pitch) series high current board-to-board connectors are available in SMT configuration.
Master Bond EP17HTDA-1 one-component die-attach epoxy can also be used for bonding and sealing.
SPS-2000 solder paste mixer features high-speed mixing capabilities (approx. 1000rpm), resulting in shorter mixing times.
Pyramax convection reflow oven now comes with optional TrueFlat technology, which reportedly ends die tilt. Is designed for substrate thicknesses of 0.15 to 0.30mm.
Press Releases
- K&F Electronics Boosts Production with New Hanwha SMT Line
- Luminovo Appoints SaaS Veteran Clifton Lobo as VP Global Sales to Accelerate International Growth
- Johan Stormlund Joins Inspectis AB as Marketing and Sales Manager, Industrial Applications
- Altus Brings Heller’s Revolutionary Short-Cycle Vacuum Reflow Oven to the UK and Ireland