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vVision and SI software use 3D solder joint measurement.

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DF40GL series low-profile flexible printed circuit connector supports FPC applications in a small package and operates at USB 3.1 gen 2 speeds up to 10Gbps.

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3D•EyeZ sensor system permits measurement of the press-in depth of press-fit connectors mounted on PCBs.

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XM Bond high-resolution camera is for inline wire bond inspection.

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SPS Smart reflow profiler is for thermal process data collection. Collects profile data and compares it to process specifications.

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ST 925 combines ST 325 programmable convective/hot air rework station, PH 100 low profile IR preheater and ST 500A Z-axis platform.

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