640-35 (dam) and 640-46 (fill) dam and fill UV-cured chip encapsulants, for chip-on-board smart card applications, protect wire bonds and reduce stresses associated with thermal cycling. Cure rapidly when exposed to intense UV light centered at 365nm. Are for encapsulating small chips in smart card applications where fast processing is required. Reportedly withstand circuit board reliability test criteria.

Engineered Material Systems, conductives.com

HighDensity module is for inspecting conformal coatings. This orthogonal camera technology for S3088 CCI inspection system is recommended for inspecting nano-plasma coatings. Can inspect temperature-resistant silicone-based coatings used to make smartphones resistant to moisture. Includes high-power LEDs attached around the camera. Can be additionally equipped with four or eight angled cameras. Is reportedly ideal for silicone or thin coatings.

Viscom, www.viscom.com

Nanolaminate coating conducts heat away from an electronics device interior, decreasing its temperature up to 20 degrees. Heat is distributed through the casing of the device, along its surface. Can be applied at low temperatures in volume.

Picosun, picosun.com

Spectra ultraviolet light curing system is an upgrade from UV1000 and UV2000. Features Unitronics PLC controller with touchscreen interface, enclosed workspace, and large access doors. Has increased conveyor height adjustment and larger component clearance. Includes inlet, outlet shutters, and lamp shutters for the top and bottom lamps. Up to 30 available profiles for programming. Each profile stores speed, mode, width, etc. of a different program. Has four different processing modes.

PVA, www.pva.net