Tabletop Shadow Moiré (TTSM) warpage metrology system measures warpage of substrates up to 300mm x 310mm (a 300mm wafer or two JEDEC trays).
FH64MA series compact flexible printed circuit (FPC) connector offers a profile of 0.5mm with 0.25mm pitch and depth of 3.15mm when locked.
EP41S-F two-part epoxy for bonding, sealing, coating and encapsulation applications combines ambient temperature cure speed with chemical resistance and superior electrical insulation properties.
Searay high-speed, high-density connectors come in 1.27 X 1.27mm open pin field grid array, with no pins dedicated as signal or ground.
Press Releases
- K&F Electronics Boosts Production with New Hanwha SMT Line
- Luminovo Appoints SaaS Veteran Clifton Lobo as VP Global Sales to Accelerate International Growth
- Johan Stormlund Joins Inspectis AB as Marketing and Sales Manager, Industrial Applications
- Altus Brings Heller’s Revolutionary Short-Cycle Vacuum Reflow Oven to the UK and Ireland