GP300S and GP500S thermal gap pads provide thermal conductivity with a wide operating temperature range. Designed for use between heat generating components and heat sinks. Operating temperature range from -50° to +160°C. For applications where rapid and efficient heat removal is required and can be cut to any size. GP300S provides thermal conductivity at 3.00 and GP500S provides higher thermal conductivity at 5.00.
Electrolube.com, www.electrolube.com
UR5639 encapsulates a variety of electrical components, and is particularly suited to LEDs. Is a clear/transparent polyurethane resin featuring low exotherm, low viscosity, low hardness and high flexibility. Relieves connecting legs of components from high levels of stress during cure.
Electrolube.com, www.electrolube.com
ER2224 thermally conductive epoxy resin offers an improved method of cure and subsequent health and safety benefits. Is said to promote heat dissipation and prolong unit service life in LED lighting units.
Electrolube, www.electrolube.com
3D·ViewZ camera module provides shadow-free 3D measurement at high speeds. Combines 2D image acquisition and 3D measurement. Orthogonal, telecentric image recording works with four angled-view cameras and four fringe projectors for measurement of components and solder joints. Inspection technologies use one field of view without additional axis movement. Integrated rotary drive allows up to 360 projection directions for 3D image acquisition.
Goepel electronics, www.goepel.com
Delta Bond optical bonding system dispenses adhesives for display devices in atmosphere, reportedly without bubbles. Is said to be for use with any optically clear adhesive, including acrylics, silicone, and epoxy. Is used for touch screen to LCD and cover glass to LCD. Can include fill dispensing, cover placement, and fluid-flow vision. Employs a gantry system featuring precision ball screw slides driven by brushless DC servo motors. Every axis of motion features optical encoder feedback. UV cure permits full area cure in place while robotically positioned.
PVA, www.pva.net
535-11M-12 UV cured epoxy has been designed to pass rigorous reliability requirements. Eliminates warpage in electronic assemblies and can be used in other bonding applications in fiber optics and camera modules. Can be used for lens bonding, chip encapsulation in smart cards and general bonding applications in photonics assembly. Cures rapidly when exposed to high-intensity UV light. Is a low outgassing, flexible, high-strength epoxy adhesive that does not contain antimony. Is a screen printable version of 535-11M-7 UV cure adhesive.
Engineered Material Systems, www.emsadhesives.com